Loading...

PCM3793RHBRG4

Texas Instruments

PCM3793RHBRG4 by Texas Instruments

PCM3793RHBRG4 by Texas Instruments is a 32-terminal telecom IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial use. The package style is chip carrier with a very thin profile, making it ideal for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,626

-

-

-

-

Digiode

USA . 4,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,115

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 749 parts In-Stock

1+ parts

$8.302

100+ parts

-

1k+ parts

-

10k+ parts

-

749

$8.302

-

-

-

Parana Technologies

USA . 1,007 parts In-Stock

1+ parts

$9.696

100+ parts

-

1k+ parts

$10.277

10k+ parts

-

1,007

$9.696

-

$10.277

-

DigiPath Technology Company

USA . 1,659 parts In-Stock

1+ parts

$10.676

100+ parts

-

1k+ parts

-

10k+ parts

-

1,659

$10.676

-

-

-

IDEA Electronic Components Group

UK . 914 parts In-Stock

1+ parts

$10.894

100+ parts

$10.349

1k+ parts

$9.805

10k+ parts

-

914

$10.894

$10.349

$9.805

-

ChromeModa Solutions

Germany . 165 parts In-Stock

1+ parts

$10.894

100+ parts

$8.933

1k+ parts

-

10k+ parts

-

165

$10.894

$8.933

-

-

Ampacity Inc.

Singapore . 188 parts In-Stock

1+ parts

$131.000

100+ parts

-

1k+ parts

-

10k+ parts

-

188

$131.000

-

-

-

Semicontronic

India . 1,265 parts In-Stock

1+ parts

$509.000

100+ parts

$496.275

1k+ parts

$493.730

10k+ parts

-

1,265

$509.000

$496.275

$493.730

-

One Stop Electronics

USA . 1,335 parts In-Stock

1+ parts

$933.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,335

$933.000

-

-

-

Corphita

USA . 1,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,366

-

-

-

-

Corohmni

South Africa . 243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

243

-

-

-

-

Kepictronics

USA . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

Overview

Experience superior quality and reliability with the PCM3793RHBRG4 by Texas Instruments, a leading manufacturer in the industry. This telecom interface IC offers unparalleled performance and versatility for a wide range of applications. With advanced technology and a durable package body material, this product ensures long-term functionality in industrial settings. Trust Texas Instruments to deliver cutting-edge solutions that provide value, benefits, and advantages to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good protection and durability for the components inside.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, especially in automated manufacturing processes.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board.

No. of Terminals: 32

Having 32 terminals allows for a high level of connectivity and functionality within the IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile makes this IC versatile and suitable for various types of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the IC can perform reliably even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of signals and power within the IC.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact overall design of the IC.

Width: 5 mm

The 5mm width of the IC makes it suitable for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures that the IC can be soldered efficiently and effectively.

Peak Reflow Temperature °C: 260

The high peak reflow temperature makes the IC suitable for lead-free soldering processes.

Length: 5 mm

The 5mm length of the IC contributes to its compact size and efficient use of space on a circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the IC can operate reliably in harsh industrial environments.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, it is specifically designed for use in telecommunications applications, ensuring optimal performance and reliability in such scenarios.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common and widely supported standard in many electronic systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high density connectivity and efficient use of space on a circuit board.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that proper handling and storage procedures must be followed to prevent damage from moisture exposure.

Technical Specifications

Other Function Telecom Interface ICs PCM3793RHBRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

PCM3793RHBRG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19