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PCM3793ARHBR

Texas Instruments

PCM3793ARHBR by Texas Instruments

PCM3793ARHBR by Texas Instruments is a 32-terminal telecom IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial applications. This chip carrier has a square shape, measures 5x5mm, and supports a nominal voltage of 3.3V.

Median Price

$9.552

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 54,275 parts In-Stock

1+ parts

$9.005

100+ parts

$7.341

1k+ parts

$4.894

10k+ parts

-

54,275

$9.005

$7.341

$4.894

-

Rochester

USA . 47,113 parts In-Stock

1+ parts

-

100+ parts

$8.080

1k+ parts

$7.230

10k+ parts

$6.810

47,113

-

$8.080

$7.230

$6.810

DigiKey

USA . 47,113 parts In-Stock

1+ parts

-

100+ parts

$10.640

1k+ parts

-

10k+ parts

-

47,113

-

$10.640

-

-

Verical

USA . 44,165 parts In-Stock

1+ parts

-

100+ parts

$10.100

1k+ parts

$9.037

10k+ parts

$8.512

44,165

-

$10.100

$9.037

$8.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,959 parts In-Stock

1+ parts

$6.460

100+ parts

-

1k+ parts

-

10k+ parts

-

3,959

$6.460

-

-

-

Vyrian

USA . 1,931 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,931

$6.800

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,697 parts In-Stock

1+ parts

$6.120

100+ parts

-

1k+ parts

-

10k+ parts

-

4,697

$6.120

-

-

-

Component Stockers USA

USA . 121,716 parts In-Stock

1+ parts

$7.220

100+ parts

$6.790

1k+ parts

$5.180

10k+ parts

$5.180

121,716

$7.220

$6.790

$5.180

$5.180

Parana Technologies

USA . 610 parts In-Stock

1+ parts

$11.244

100+ parts

-

1k+ parts

$11.679

10k+ parts

-

610

$11.244

-

$11.679

-

ChromeModa Solutions

Germany . 5,496 parts In-Stock

1+ parts

$12.634

100+ parts

$10.360

1k+ parts

-

10k+ parts

-

5,496

$12.634

$10.360

-

-

IDEA Electronic Components Group

UK . 2,124 parts In-Stock

1+ parts

$12.634

100+ parts

$12.002

1k+ parts

$11.371

10k+ parts

-

2,124

$12.634

$12.002

$11.371

-

Lixinc

USA . 6,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,506

-

-

-

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Perfect Parts

USA . 6,225 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,225

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-

-

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A-Z Elektronik GmbH

Germany . 6,185 parts In-Stock

1+ parts

-

100+ parts

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6,185

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-

-

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Kepictronics

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,000

-

-

-

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Assy Fe

Spain . 2,123 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,123

-

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

DigiPath Technology Company

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$11.391

1k+ parts

-

10k+ parts

-

20

-

$11.391

-

-

Overview

Experience unparalleled quality and reliability with the PCM3793ARHBR by Texas Instruments, a leading manufacturer in the industry. This innovative Other Function Telecom Interface IC offers cutting-edge technology for a wide range of applications. From its durable plastic epoxy package body material to its advanced terminal finish of nickel palladium gold, this product ensures top-notch performance in industrial settings. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, the PCM3793ARHBR delivers exceptional value and benefits to customers looking for a dependable solution. Trust Texas Instruments for excellence in telecom circuit technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient mounting on PCBs, saving space and enabling automated assembly processes.

Package Shape: SQUARE

The square package shape provides stability and ease of handling during installation.

No. of Terminals: 32

Having a higher number of terminals allows for more connections and functionalities within the IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design improves thermal management and overall performance of the IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability in various operating environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and better signal integrity.

Maximum Seated Height: 1 mm

The low maximum seated height is beneficial for space-constrained applications and allows for compact designs.

Width: 5 mm

The compact width of the IC enables it to fit into tight spaces while maintaining high performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures that the IC is not subjected to excessive heat, preserving its integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and rework processes.

Length: 5 mm

The compact length of the IC contributes to its overall small footprint and ease of integration into systems.

Temperature Grade: INDUSTRIAL

Being industrial-grade, the IC is designed to withstand harsh environmental conditions and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems.

Terminal Form: NO LEAD

The use of no-lead terminal form enhances the reliability of the IC and makes it environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC offers optimized performance and functionalities for telecommunications.

Nominal Supply Voltage: 3.3 V

The specified nominal supply voltage ensures the compatibility of the IC with standard power sources in telecom applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for more terminals in a compact space, enabling high-density integration and connectivity.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that the IC has moderate sensitivity to moisture exposure, requiring standard handling precautions.

Technical Specifications

Other Function Telecom Interface ICs PCM3793ARHBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

PCM3793ARHBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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