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PCM3794ARHBRG4

Texas Instruments

PCM3794ARHBRG4 by Texas Instruments

PCM3794ARHBRG4 by Texas Instruments is a Telecom Interface IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. It operates at a nominal voltage of 3.3V and uses CMOS technology for telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,952 parts In-Stock

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Digiode

USA . 1,359 parts In-Stock

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1,359

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Distributors (Availability)

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Parana Technologies

USA . 614 parts In-Stock

1+ parts

$13.769

100+ parts

-

1k+ parts

$14.256

10k+ parts

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614

$13.769

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$14.256

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DigiPath Technology Company

USA . 1,243 parts In-Stock

1+ parts

$15.162

100+ parts

$13.949

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1,243

$15.162

$13.949

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ChromeModa Solutions

Germany . 4,303 parts In-Stock

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$15.471

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$12.686

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4,303

$15.471

$12.686

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IDEA Electronic Components Group

UK . 1,596 parts In-Stock

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$15.471

100+ parts

$14.697

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$13.924

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1,596

$15.471

$14.697

$13.924

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AZTECH Wire

Italy . 604 parts In-Stock

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$18.521

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604

$18.521

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Semicontronic

India . 595 parts In-Stock

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$790.000

100+ parts

$770.250

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$766.300

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595

$790.000

$770.250

$766.300

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Ampacity Inc.

Singapore . 977 parts In-Stock

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$972.000

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977

$972.000

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One Stop Electronics

USA . 1,139 parts In-Stock

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$987.000

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$987.000

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Corphita

USA . 2,893 parts In-Stock

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2,893

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Metaverse IC Inc.

Canada . 2,306 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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Overview

Experience high-quality communication solutions with the PCM3794ARHBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that excel in performance and reliability. This telecom interface IC offers unparalleled value, providing seamless connectivity for a wide range of applications. Whether you're looking to enhance your telecommunications system or improve overall efficiency, the PCM3794ARHBRG4 is the perfect solution for your needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the product, making it a good choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the PCB, allowing for compact designs.

No. of Terminals: 32

Having 32 terminals provides versatility in connectivity options, making this product suitable for various telecom interface requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in a wide range of environmental conditions.

Nominal Supply Voltage: 3.3 V

Operates at a standard nominal supply voltage of 3.3V, compatible with many existing systems and power sources.

Technical Specifications

Other Function Telecom Interface ICs PCM3794ARHBRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

PCM3794ARHBRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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