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PCI2250PGFG4

Texas Instruments

PCI2250PGFG4 by Texas Instruments

PCI2250PGFG4 by Texas Instruments is a 32-bit bus controller with a max clock frequency of 33 MHz. It operates b/w 0-70°C and supports CardBus, ISA, and VGA buses. The package style is flatpack with low profile and fine pitch terminals, making it suitable for commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,676 parts In-Stock

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Digiode

USA . 1,028 parts In-Stock

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1,028

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Distributors (Availability)

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One Stop Electronics

USA . 881 parts In-Stock

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$12.000

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881

$12.000

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AZTECH Wire

Italy . 747 parts In-Stock

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$18.700

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747

$18.700

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Parana Technologies

USA . 938 parts In-Stock

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$24.487

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$25.151

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938

$24.487

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$25.151

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DigiPath Technology Company

USA . 696 parts In-Stock

1+ parts

$26.963

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$24.806

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696

$26.963

$24.806

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ChromeModa Solutions

Germany . 5,328 parts In-Stock

1+ parts

$27.513

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$22.561

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5,328

$27.513

$22.561

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

1+ parts

$27.513

100+ parts

$26.137

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$24.762

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1,695

$27.513

$26.137

$24.762

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Corohmni

South Africa . 208 parts In-Stock

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$75.760

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208

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Corphita

USA . 3,986 parts In-Stock

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Microchip USA

USA . 2,126 parts In-Stock

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Overview

Elevate your system's performance with the Texas Instruments PCI2250PGFG4 Bus Controller. Crafted by a renowned manufacturer, this top-of-the-line product boasts exceptional quality and reliability. Designed for a wide range of applications, this bus controller offers unparalleled value to customers seeking seamless connectivity and efficient data transfer. Say goodbye to slow processing speeds and hello to enhanced performance with this cutting-edge solution. Upgrade your system today and experience the benefits firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the bus controller, ensuring longevity and ease of installation.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with different power sources.

Address Bus Width: 32

Offers a high address bus width, allowing for efficient communication and data transfer between components.

Package Shape: SQUARE

The square shape helps in optimizing space utilization on the circuit board, especially in compact designs.

No. of Terminals: 176

Having a high number of terminals enables connectivity with multiple devices, enhancing the functionality of the bus controller.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and extends the operational life of the bus controller.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the bus controller to function reliably in various environments, even under moderate heat conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the bus controller can operate effectively even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, improving the overall reliability and longevity of the bus controller.

Terminal Position: QUAD

The quad terminal position layout enhances the connectivity options and flexibility of the bus controller, enabling easy integration into different systems.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a slim and compact design, ideal for space-constrained applications.

Width: 24 mm

The standard width makes the bus controller compatible with various mounting configurations and standard board sizes.

External Data Bus Width: 32

Matching the external data bus width to the address bus width ensures efficient data transfer and communication performance.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency enables fast and reliable data processing, essential for high-performance applications.

Peak Reflow Temperature: 260 °C

The peak reflow temperature ensures stable and secure solder connections during the assembly process, improving the overall durability of the bus controller.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the bus controller is suitable for standard commercial environments, offering reliable performance under normal operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Being a PCI bus controller, it offers high-speed data transfer and compatibility with a wide range of peripheral devices, enhancing the overall functionality of the system.

Technology: CMOS

Utilizing CMOS technology ensures efficient power consumption and high-speed operation, making the bus controller energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and enhances the mechanical stability of the connections, ensuring a secure and reliable installation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a stable power source for the bus controller, ensuring consistent and reliable operation.

Bus Compatibility: CARDBUS; ISA; VGA

Supporting compatibility with various bus standards like CARDBUS, ISA, and VGA makes the bus controller versatile and suitable for a wide range of applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact and space-saving PCB layouts, ideal for miniaturized designs or densely populated circuit boards.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level ensures that the bus controller can be safely stored and used in typical factory environments.

Technical Specifications

Bus Controllers PCI2250PGFG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

DEVICE HAVING 32-BIT MULTIPLEXED PRIMARY AND SECONDARY ADDRESS AND DATA BUS.

Address Bus Width:

32

Bus Compatibility:

CARDBUS; ISA; VGA

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

PCI2250PGFG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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