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OPA361AIDCKRG4

Texas Instruments

OPA361AIDCKRG4 by Texas Instruments

OPA361AIDCKRG4 by Texas Instruments is a video amplifier IC with 6 terminals, operating voltage of 2.5-3.3V, and max temp of 125°C. It is used in automotive applications due to its small outline package and dual terminal position, making it ideal for audio & video amplification in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,188 parts In-Stock

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7,188

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North Shore Components

USA . 3,000 parts In-Stock

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3,000

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Digiode

USA . 998 parts In-Stock

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998

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,276 parts In-Stock

1+ parts

$2.022

100+ parts

$187.781

1k+ parts

$1.820

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2,276

$2.022

$187.781

$1.820

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DigiPath Technology Company

USA . 1,052 parts In-Stock

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$2.227

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$2.048

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1,052

$2.227

$2.048

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ChromeModa Solutions

Germany . 731 parts In-Stock

1+ parts

$2.272

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$1.863

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731

$2.272

$1.863

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IDEA Electronic Components Group

UK . 617 parts In-Stock

1+ parts

$2.272

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$2.045

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617

$2.272

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$2.045

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One Stop Electronics

USA . 135 parts In-Stock

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$7.800

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135

$7.800

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AZTECH Wire

Italy . 340 parts In-Stock

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$19.014

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340

$19.014

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Kepictronics

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 728 parts In-Stock

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728

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Microchip USA

USA . 292 parts In-Stock

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Corphita

USA . 180 parts In-Stock

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180

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Overview

Elevate your audio and video experience with the OPA361AIDCKRG4 by Texas Instruments! Crafted with precision and expertise, this video amplifier offers unparalleled quality and reliability. Perfect for a wide range of applications, this compact and versatile device delivers exceptional performance while ensuring seamless integration. Enhance your projects with the cutting-edge technology and superior design of Texas Instruments, and unlock a world of possibilities with the OPA361AIDCKRG4. Elevate your audio and video experience like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the amplifier, ensuring a long lifespan.

Power Supplies (V): 3

Operates on a 3V power supply, making it compatible with a wide range of devices and systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures up to 125°C, making it suitable for use in various environments.

Minimum Operating Temperature: -40 °C

With a low operating temperature of -40°C, this amplifier can function reliably even in extreme cold conditions.

Maximum Seated Height: 1.1 mm

Compact design with a maximum seated height of 1.1mm allows for space-efficient installation in tight spaces.

Width: 1.25 mm

Narrow width of 1.25mm enables easy placement on circuit boards without taking up much space.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliable performance under harsh conditions typically found in vehicles.

Technical Specifications

Audio & Video Amplifiers OPA361AIDCKRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

OPA361AIDCKRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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