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OPA359IDBVT

Texas Instruments

OPA359IDBVT by Texas Instruments

OPA359IDBVT by Texas Instruments is a video amplifier IC with 6 terminals, operating from -40 to 125°C. It has a supply voltage of 3V and low current consumption at 6.5mA, suitable for automotive applications due to its small outline package and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,768 parts In-Stock

1+ parts

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2,768

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Digiode

USA . 2,676 parts In-Stock

1+ parts

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2,676

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 554 parts In-Stock

1+ parts

$3.418

100+ parts

-

1k+ parts

$3.943

10k+ parts

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554

$3.418

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$3.943

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ChromeModa Solutions

Germany . 2,842 parts In-Stock

1+ parts

$3.840

100+ parts

$3.149

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2,842

$3.840

$3.149

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IDEA Electronic Components Group

UK . 1,914 parts In-Stock

1+ parts

$3.840

100+ parts

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$3.456

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1,914

$3.840

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$3.456

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AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$6.243

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305

$6.243

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One Stop Electronics

USA . 888 parts In-Stock

1+ parts

$10.800

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888

$10.800

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DigiPath Technology Company

USA . 1,616 parts In-Stock

1+ parts

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100+ parts

$3.462

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1,616

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$3.462

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Corphita

USA . 1,170 parts In-Stock

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1,170

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Overview

Enhance your audio and video experience with the OPA359IDBVT by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of products that cater to various applications in the audio and video amplifier category. The OPA359IDBVT stands out for its compact package style, low power consumption, and automotive-grade temperature tolerance. Elevate your sound and visual systems with this advanced video amplifier, designed to deliver exceptional performance and precision. Upgrade your equipment today and enjoy the benefits of high-quality audio and video amplification like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials are durable and reliable, making this product suitable for use in various environments.

Surface Mount: YES

Surface mount technology allows for easy installation and compatibility with modern electronic devices.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, saving space and allowing for easy integration into different applications.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality video signals and optimal performance.

Power Supplies (V): 3

Operates at low voltage, making it energy-efficient and suitable for portable or battery-powered devices.

No. of Terminals: 6

Sufficient number of terminals for easy connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Small outline and thin profile design enhance space-saving and enable applications with limited space availability.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and allows for different wiring configurations.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the amplifier can withstand temperature fluctuations associated with automotive applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and ease of soldering during assembly.

Maximum Supply Current: 6.5 mA

Low supply current consumption helps to conserve energy and prolong the lifespan of the amplifier.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for compact layout design and efficient use of board space.

Technical Specifications

Audio & Video Amplifiers OPA359IDBVT attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G6

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

OPA359IDBVT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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