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OPA358IDBVR

Texas Instruments

OPA358IDBVR by Texas Instruments

OPA358IDBVR by Texas Instruments is a video amplifier IC with 6 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and low current consumption of 6.5mA, suitable for automotive applications due to its small outline package and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,316 parts In-Stock

1+ parts

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4,316

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Digiode

USA . 2,037 parts In-Stock

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2,037

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1 parts In-Stock

1+ parts

$2.977

100+ parts

-

1k+ parts

$3.478

10k+ parts

-

1

$2.977

-

$3.478

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DigiPath Technology Company

USA . 1,664 parts In-Stock

1+ parts

$3.278

100+ parts

$3.016

1k+ parts

-

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1,664

$3.278

$3.016

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ChromeModa Solutions

Germany . 1,422 parts In-Stock

1+ parts

$3.345

100+ parts

$2.743

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1,422

$3.345

$2.743

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IDEA Electronic Components Group

UK . 312 parts In-Stock

1+ parts

$3.345

100+ parts

-

1k+ parts

$3.010

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312

$3.345

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$3.010

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One Stop Electronics

USA . 1,563 parts In-Stock

1+ parts

$4.800

100+ parts

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1,563

$4.800

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AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$7.543

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568

$7.543

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Corphita

USA . 1,331 parts In-Stock

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1,331

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Overview

Enhance your audio and video experience with the OPA358IDBVR by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable and efficient solutions for a variety of applications. This video amplifier is designed to provide clear and crisp sound and image quality, making it perfect for home entertainment systems, automotive displays, and more. With low power consumption and a compact design, this amplifier offers great value and performance for all your audio and video needs. Upgrade your setup today with the OPA358IDBVR!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, saving space on the circuit board.

General IC Type: VIDEO AMPLIFIER

Video amplifier IC type ensures high-quality video signal processing and amplification.

Power Supplies (V): 3

Supports a power supply of 3 volts, suitable for a wide range of applications.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Small outline and thin profile package style makes it suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures makes it ideal for use in various environments.

Terminal Position: DUAL

Dual terminal position allows for efficient signal processing and connectivity.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures performance in automotive applications.

Terminal Form: GULL WING

Gull Wing terminal form provides secure and reliable connections to the circuit board.

Maximum Supply Current: 6.5 mA

Low maximum supply current helps in reducing power consumption and operating costs.

Terminal Pitch: 0.95 mm

Fine terminal pitch of 0.95mm allows for precise and space-saving connections on the circuit board.

Technical Specifications

Audio & Video Amplifiers OPA358IDBVR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G6

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

OPA358IDBVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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