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OPA359IDCKT

Texas Instruments

OPA359IDCKT by Texas Instruments

OPA359IDCKT by Texas Instruments is a video amplifier IC with 6 terminals, operating b/w -40°C to 125°C. It has a supply voltage of 3V and low current consumption at 6.5mA, making it suitable for automotive applications due to its small outline package and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,314 parts In-Stock

1+ parts

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4,314

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Digiode

USA . 2,068 parts In-Stock

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2,068

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 31 parts In-Stock

1+ parts

$1.879

100+ parts

-

1k+ parts

$2.424

10k+ parts

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31

$1.879

-

$2.424

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IDEA Electronic Components Group

UK . 1,221 parts In-Stock

1+ parts

$2.111

100+ parts

-

1k+ parts

$1.900

10k+ parts

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1,221

$2.111

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$1.900

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ChromeModa Solutions

Germany . 586 parts In-Stock

1+ parts

$2.111

100+ parts

$1.731

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-

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586

$2.111

$1.731

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AZTECH Wire

Italy . 459 parts In-Stock

1+ parts

$5.870

100+ parts

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459

$5.870

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One Stop Electronics

USA . 1,001 parts In-Stock

1+ parts

$20.800

100+ parts

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1,001

$20.800

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Corphita

USA . 4,684 parts In-Stock

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4,684

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DigiPath Technology Company

USA . 2,258 parts In-Stock

1+ parts

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100+ parts

$1.903

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2,258

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$1.903

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Overview

Enhance your audio and video experience with the OPA359IDCKT by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality audio and video amplifiers that bring clarity and precision to your projects. This versatile component is perfect for automotive applications, ensuring reliable performance even in extreme temperatures. With its small outline and dual terminal position, the OPA359IDCKT offers convenience and efficiency in one sleek package. Upgrade your sound and visuals today with this cutting-edge amplifier from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the amplifier, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy installation and compact design, making it ideal for space-constrained setups.

Package Shape: RECTANGULAR

Rectangular package shape is easy to handle and integrates well with other components in a circuit or system.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality video signal transmission and processing.

Power Supplies (V): 3

Low power supply requirement of 3V makes it energy-efficient and suitable for battery-powered devices.

No. of Terminals: 6

Sufficient number of terminals for connection flexibility and compatibility with various circuit layouts.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance of 125°C ensures reliability and stable performance in different thermal conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature (-40°C) allows for operation in extreme cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal transmission reliability.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the amplifier can withstand temperature fluctuations in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure connections and ease of soldering during assembly.

Maximum Supply Current: 6.5 mA

Low maximum supply current of 6.5 mA minimizes power consumption and heat dissipation, contributing to energy efficiency.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635 mm allows for compact PCB design and high-density mounting, saving space in the overall circuit layout.

Technical Specifications

Audio & Video Amplifiers OPA359IDCKT attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G6

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

OPA359IDCKT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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