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LM1876T/NOPB

Texas Instruments

LM1876T/NOPB by Texas Instruments

LM1876T/NOPB by Texas Instruments is a 2-channel audio amplifier with a nominal output power of 22W and gain of 110dB. It operates b/w -20 to 85°C, suitable for various audio applications. The package style is flange mount with 15 terminals in zig-zag position, making it ideal for through-hole mounting.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Anansix

USA . 1,525 parts In-Stock

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Digiode

USA . 1,038 parts In-Stock

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Vyrian

USA . 1,033 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 66 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 11 parts In-Stock

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Holdelec - ElecDif-Pro

France . 11 parts In-Stock

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Parana Technologies

USA . 975 parts In-Stock

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$2.686

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$3.170

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975

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ChromeModa Solutions

Germany . 2,186 parts In-Stock

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$3.018

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$2.475

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IDEA Electronic Components Group

UK . 239 parts In-Stock

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$3.018

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$2.716

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AZTECH Wire

Italy . 256 parts In-Stock

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$19.522

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One Stop Electronics

USA . 1,180 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,309 parts In-Stock

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Continental Prestige Electronics

USA . 4,845 parts In-Stock

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Microchip USA

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Argo Parts USA

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Lixinc

USA . 2,692 parts In-Stock

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Aranea Global

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Corphita

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Perfect Parts

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DigiPath Technology Company

USA . 237 parts In-Stock

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$2.721

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Overview

Experience superior audio quality with the LM1876T/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this audio amplifier that are perfect for a variety of applications. Whether you're looking to enhance your home entertainment system or upgrade your car audio setup, this amplifier offers unparalleled value, benefits, and advantages. Get ready to elevate your sound experience with the LM1876T/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the amplifier components, making it suitable for long-term use.

General IC Type: AUDIO AMPLIFIER

Specifically designed for amplifying audio signals, ensuring high-quality sound output.

Nominal Output Power: 22 W

Delivers a strong audio output, making it suitable for a variety of applications including home theaters or sound systems.

No. of Channels: 2

Provides stereo sound output, enhancing the audio experience for the user.

Technology: BIPOLAR

Bipolar technology offers high-quality amplification, ensuring optimal performance of the audio signals.

Gain: 110 dB

High gain capability allows for amplifying weak audio signals without introducing distortion, resulting in clear and crisp sound output.

Technical Specifications

Audio & Video Amplifiers LM1876T/NOPB attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

110 dB

JESD-30 Code:

R-PZFM-T15

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Power:

22 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

ZIP15,.2,.17TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

22 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LM1876T/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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