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OPA358IDCKR

Texas Instruments

OPA358IDCKR by Texas Instruments

OPA358IDCKR by Texas Instruments is a video amplifier IC with 6 terminals, operating from -40 to 125°C. It has a supply voltage of 3V and low current consumption at 6.5mA, suitable for automotive applications due to its gull wing terminal form and small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,711 parts In-Stock

1+ parts

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7,711

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Digiode

USA . 3,333 parts In-Stock

1+ parts

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3,333

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,058 parts In-Stock

1+ parts

$2.054

100+ parts

-

1k+ parts

$2.576

10k+ parts

-

1,058

$2.054

-

$2.576

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DigiPath Technology Company

USA . 1,093 parts In-Stock

1+ parts

$2.262

100+ parts

$2.081

1k+ parts

-

10k+ parts

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1,093

$2.262

$2.081

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ChromeModa Solutions

Germany . 3,502 parts In-Stock

1+ parts

$2.308

100+ parts

$1.893

1k+ parts

-

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3,502

$2.308

$1.893

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IDEA Electronic Components Group

UK . 1,260 parts In-Stock

1+ parts

$2.308

100+ parts

-

1k+ parts

$2.077

10k+ parts

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1,260

$2.308

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$2.077

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One Stop Electronics

USA . 590 parts In-Stock

1+ parts

$7.800

100+ parts

-

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590

$7.800

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AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$17.644

100+ parts

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282

$17.644

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Corphita

USA . 1,863 parts In-Stock

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1,863

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Overview

Enhance your audio and video experience with the OPA358IDCKR from Texas Instruments. Known for its high-quality manufacturing, Texas Instruments delivers top-notch performance in the Audio & Video Amplifiers category. This versatile product is perfect for a wide range of applications, providing customers with exceptional value and benefits. Elevate your projects with the OPA358IDCKR's cutting-edge technology and reliable performance, setting new standards for audio and video amplification. Choose Texas Instruments for unmatched quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and resistance to external factors while keeping the overall weight of the amplifier low.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design that can fit into tight spaces within electronic devices.

General IC Type: VIDEO AMPLIFIER

The specific type of video amplifier ensures optimal performance and compatibility with video signals, making it a reliable choice for audio and video applications.

Power Supplies (V): 3

Operating at 3 volts provides efficient power consumption and compatibility with a wide range of electronic devices.

No. of Terminals: 6

Having 6 terminals allows for multiple connections and a variety of input and output options, offering flexibility in system configurations.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this amplifier can withstand temperature fluctuations and environmental challenges commonly encountered in vehicle settings.

Maximum Supply Current: 6.5 mA

With a low maximum supply current, this amplifier is energy-efficient and helps minimize power consumption in electronic systems.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for precise and compact connections, making it suitable for high-density circuit layouts and miniaturized devices.

Technical Specifications

Audio & Video Amplifiers OPA358IDCKR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G6

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

OPA358IDCKR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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