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TL592B-8DRG4

Texas Instruments

TL592B-8DRG4 by Texas Instruments

TL592B-8DRG4 by Texas Instruments is a video amplifier IC with a power supply range of +-6V, 50 kHz bandwidth, and 27mA max supply current. It is used in audio/video applications due to its small outline package, commercial temperature grade, and bipolar technology for high-quality signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,343 parts In-Stock

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5,343

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Digiode

USA . 2,658 parts In-Stock

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2,658

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Nova Conductors

Japan . 36 parts In-Stock

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36

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,170 parts In-Stock

1+ parts

$1.069

100+ parts

-

1k+ parts

$1.922

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1,170

$1.069

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$1.922

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ChromeModa Solutions

Germany . 6,748 parts In-Stock

1+ parts

$1.201

100+ parts

$0.985

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-

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6,748

$1.201

$0.985

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IDEA Electronic Components Group

UK . 1,583 parts In-Stock

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$1.201

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$1.081

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1,583

$1.201

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$1.081

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One Stop Electronics

USA . 489 parts In-Stock

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$6.800

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489

$6.800

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Ampacity Inc.

Singapore . 168 parts In-Stock

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$8.800

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168

$8.800

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AZTECH Wire

Italy . 723 parts In-Stock

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$17.885

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723

$17.885

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Argo Parts USA

USA . 1,670 parts In-Stock

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1,670

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 856 parts In-Stock

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Continental Prestige Electronics

USA . 842 parts In-Stock

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842

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DigiPath Technology Company

USA . 249 parts In-Stock

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$1.083

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249

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$1.083

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Overview

Enhance your audio and video experiences with the TL592B-8DRG4 by Texas Instruments, a top-quality video amplifier that delivers exceptional performance in a compact package. Manufactured by industry leader Texas Instruments, this product is designed to provide reliable and efficient amplification for a wide range of applications. With its small outline package style and wide operating temperature range, the TL592B-8DRG4 offers value and benefits that cater to the needs of customers seeking high-quality audio and video solutions. Upgrade your systems now with this advanced technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the amplifier lightweight and durable, ideal for portable or stationary use.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video amplification, this IC type ensures optimal performance and signal quality for video applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this amplifier can reliably function in various environments without overheating.

Nominal Bandwidth: 50 kHz

The wide nominal bandwidth of 50 kHz ensures that the amplifier can handle a range of frequencies, making it suitable for different types of audio and video signals.

Technical Specifications

Audio & Video Amplifiers TL592B-8DRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

50 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

27 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TL592B-8DRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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