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TL592AP3

Texas Instruments

TL592AP3 by Texas Instruments

TL592AP3 by Texas Instruments is a video amplifier IC with +-6V power supplies. It features 8 terminals in an in-line package style, operating b/w 0-70°C. Ideal for audio/video applications requiring a commercial-grade bipolar technology solution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,516 parts In-Stock

1+ parts

-

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3,516

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Vyrian

USA . 2,224 parts In-Stock

1+ parts

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2,224

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 774 parts In-Stock

1+ parts

$0.946

100+ parts

-

1k+ parts

$1.852

10k+ parts

-

774

$0.946

-

$1.852

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ChromeModa Solutions

Germany . 2,752 parts In-Stock

1+ parts

$1.063

100+ parts

$0.872

1k+ parts

-

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2,752

$1.063

$0.872

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IDEA Electronic Components Group

UK . 1,761 parts In-Stock

1+ parts

$1.063

100+ parts

-

1k+ parts

$0.957

10k+ parts

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1,761

$1.063

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$0.957

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One Stop Electronics

USA . 779 parts In-Stock

1+ parts

$16.800

100+ parts

-

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779

$16.800

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AZTECH Wire

Italy . 616 parts In-Stock

1+ parts

$18.054

100+ parts

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616

$18.054

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DigiPath Technology Company

USA . 2,143 parts In-Stock

1+ parts

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100+ parts

$0.958

1k+ parts

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2,143

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$0.958

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Corphita

USA . 1,693 parts In-Stock

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1,693

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Overview

Enhance your audio and video experience with the TL592AP3 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch performance in the Audio & Video Amplifiers category. With its compact rectangular package and dual terminal position, this video amplifier is perfect for a wide range of applications. Whether you're looking to boost the sound quality of your home entertainment system or enhance the visuals on your video displays, the TL592AP3 offers unmatched value and benefits. Upgrade your audio and video setup today with Texas Instruments' TL592AP3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product lightweight and durable, ideal for portable or long-term use.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various electronic devices or systems.

General IC Type: VIDEO AMPLIFIER

Video amplifier IC type ensures high-quality video output signals for a clear and crisp viewing experience.

Power Supplies (V): +-6

Dual power supplies of +-6V provide a stable and reliable power source for optimal amplifier performance.

No. of Terminals: 8

8 terminals offer flexibility for connecting to other components or systems, allowing for versatile use.

Package Style (Meter): IN-LINE

In-line package style simplifies installation and connection, making it convenient for users.

Maximum Operating Temperature: 70 °C

Maximum operating temperature of 70°C ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: 0 °C

Minimum operating temperature of 0°C allows for operation in various temperature conditions without overheating.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in wiring connections for increased reliability.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial applications.

Technology: BIPOLAR

Bipolar technology offers high signal fidelity and low noise, resulting in superior audio and video performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering connections, ensuring a stable electrical connection.

Maximum Supply Current: 27 mA

Maximum supply current of 27 mA ensures efficient power consumption and prolongs the lifespan of the amplifier.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54 mm provides ample spacing for easy terminal connections and prevents short circuits.

Technical Specifications

Audio & Video Amplifiers TL592AP3 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-6

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

27 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TL592AP3 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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