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TL592BN

Texas Instruments

TL592BN by Texas Instruments

TL592BN by Texas Instruments is a video amplifier IC with 14 terminals and a gain of 52 dB. Operating at temperatures from 0 to 70°C, it has a bandwidth of 50 kHz and requires a supply voltage of 3-8V. Ideal for audio/video applications, this IC is designed in an inline package style measuring 19.305mm x 7.62mm x 5.08mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,521 parts In-Stock

1+ parts

-

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5,521

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Digiode

USA . 4,501 parts In-Stock

1+ parts

-

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4,501

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Bristol Electronics

USA . 143 parts In-Stock

1+ parts

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143

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Atlantic Semiconductor

USA . 143 parts In-Stock

1+ parts

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143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,260 parts In-Stock

1+ parts

$3.458

100+ parts

-

1k+ parts

$3.983

10k+ parts

-

2,260

$3.458

-

$3.983

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DigiPath Technology Company

USA . 498 parts In-Stock

1+ parts

$3.807

100+ parts

$3.503

1k+ parts

-

10k+ parts

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498

$3.807

$3.503

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ChromeModa Solutions

Germany . 4,976 parts In-Stock

1+ parts

$3.885

100+ parts

$3.186

1k+ parts

-

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4,976

$3.885

$3.186

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IDEA Electronic Components Group

UK . 2,142 parts In-Stock

1+ parts

$3.885

100+ parts

-

1k+ parts

$3.496

10k+ parts

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2,142

$3.885

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$3.496

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One Stop Electronics

USA . 143 parts In-Stock

1+ parts

$16.800

100+ parts

-

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143

$16.800

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$17.270

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744

$17.270

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Corphita

USA . 66 parts In-Stock

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66

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Overview

Enhance your audio and video projects with the TL592BN by Texas Instruments, a top-quality video amplifier designed for superior performance. Manufactured by Texas Instruments, known for their cutting-edge technology and reliability, this product offers exceptional value and benefits. With its wide range of applications in audio and video amplification, this versatile component provides customers with high-quality results and unmatched precision. Upgrade your projects today with the TL592BN and experience the difference that Texas Instruments products can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the amplifier lightweight and durable, making it easy to handle and long-lasting.

Power Supplies (V): +-6

The power supply range of +-6V allows for flexibility in power input, making it compatible with a variety of systems and applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this amplifier can perform reliably in different environmental conditions without overheating.

Nominal Bandwidth: 50 kHz

The wide nominal bandwidth of 50 kHz ensures that the amplifier can accurately reproduce high-frequency signals, making it suitable for audio and video applications.

Gain: 52 dB

A gain of 52 dB indicates a high amplification capability, providing clear and strong output signals for improved audio and video performance.

Technical Specifications

Audio & Video Amplifiers TL592BN attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

50 kHz

General IC Type:

Gain:

52 dB

JESD-30 Code:

R-PDIP-T14

Length:

19.305 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-6

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

27 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TL592BN General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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