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TLC2470IP

Texas Instruments

TLC2470IP by Texas Instruments

TLC2470IP by Texas Instruments is an 8-terminal audio amplifier with a max supply current of 50mA. It operates in industrial temperature range from -40°C to 85°C, making it suitable for various audio and video applications. The package style is in-line rectangular shape made of plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Digiode

USA . 2,910 parts In-Stock

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Vyrian

USA . 945 parts In-Stock

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A&K Electronics

USA . 30 parts In-Stock

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30

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Bristol Electronics

USA . 30 parts In-Stock

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30

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Nova Conductors

Japan . 15 parts In-Stock

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Resion

USA . 13 parts In-Stock

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Corohmni

South Africa . 218 parts In-Stock

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$0.988

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218

$0.988

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Parana Technologies

USA . 635 parts In-Stock

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$2.931

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$3.430

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635

$2.931

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$3.430

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DigiPath Technology Company

USA . 2,010 parts In-Stock

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$3.227

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$3.227

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ChromeModa Solutions

Germany . 5,219 parts In-Stock

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$3.293

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$2.700

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IDEA Electronic Components Group

UK . 1,815 parts In-Stock

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$3.293

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$2.964

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Ampacity Inc.

Singapore . 1,634 parts In-Stock

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$8.800

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One Stop Electronics

USA . 1,537 parts In-Stock

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$16.800

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AZTECH Wire

Italy . 588 parts In-Stock

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$17.113

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Argo Parts USA

USA . 4,865 parts In-Stock

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Infinite Electronics LLP (Excess)

. 4,694 parts In-Stock

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Corphita

USA . 3,890 parts In-Stock

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Assy Fe

Spain . 1,084 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Kepictronics

USA . 170 parts In-Stock

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Continental Prestige Electronics

USA . 132 parts In-Stock

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Overview

Experience the ultimate in audio amplification with the TLC2470IP by Texas Instruments. Known for their superior quality and reliability, Texas Instruments has been a leader in the industry for years. The TLC2470IP is perfect for a wide range of applications in the audio and video amplifier category. With its durable plastic/epoxy package body and industrial-grade temperature grade, this product offers unmatched value and benefits to customers. Upgrade your audio experience today with the TLC2470IP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable audio setups.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on a circuit board, making it easier for assembly and integration into audio systems.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier, this product is specifically designed to enhance and amplify audio signals with high fidelity, making it perfect for sound systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this amplifier can withstand prolonged use and high temperatures without the risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments, making it versatile for various applications.

Maximum Supply Current: 50 mA

The low maximum supply current of 50 mA ensures efficient power usage, making it energy-efficient and cost-effective for long-term use.

Technical Specifications

Audio & Video Amplifiers TLC2470IP attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

50 mA

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TLC2470IP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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