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TL592ADR

Texas Instruments

TL592ADR by Texas Instruments

TL592ADR by Texas Instruments is an 8-terminal video amplifier with a gain of 52.9 dB and a bandwidth of 50 kHz. It operates b/w temperatures of 0 to 70°C, making it suitable for commercial applications requiring small outline packages and surface mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,522 parts In-Stock

1+ parts

-

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1k+ parts

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4,522

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Vyrian

USA . 3,519 parts In-Stock

1+ parts

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3,519

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 380 parts In-Stock

1+ parts

$1.115

100+ parts

-

1k+ parts

$1.946

10k+ parts

-

380

$1.115

-

$1.946

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DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$1.228

100+ parts

-

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2,120

$1.228

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ChromeModa Solutions

Germany . 4,737 parts In-Stock

1+ parts

$1.253

100+ parts

$1.027

1k+ parts

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4,737

$1.253

$1.027

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IDEA Electronic Components Group

UK . 1,218 parts In-Stock

1+ parts

$1.253

100+ parts

-

1k+ parts

$1.128

10k+ parts

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1,218

$1.253

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$1.128

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One Stop Electronics

USA . 1,289 parts In-Stock

1+ parts

$11.800

100+ parts

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1,289

$11.800

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AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$12.587

100+ parts

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841

$12.587

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Corphita

USA . 4,747 parts In-Stock

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4,747

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Overview

Enhance your audio and video experience with the TL592ADR by Texas Instruments. With a reputation for producing high-quality products, Texas Instruments delivers reliable amplifiers that cater to a variety of applications in the audio and video industry. The TL592ADR offers customers exceptional value, benefits, and advantages, making it the perfect choice for your amplification needs. Experience superior performance and quality with this compact and versatile video amplifier, designed to elevate your audio and video projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the amplifier, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for compact placement on the circuit board, optimizing space usage.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video applications, ensuring high-quality video signal amplification.

No. of Terminals: 8

Provides sufficient connectivity options for various input and output devices, increasing versatility.

Maximum Operating Temperature: 70 °C

Can operate efficiently even in high-temperature environments, ensuring performance stability.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement allows for compatibility with a wide range of power sources.

Nominal Bandwidth: 50 kHz

Wide bandwidth ensures high-frequency video signals can be amplified accurately and effectively.

Technical Specifications

Audio & Video Amplifiers TL592ADR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

50 kHz

General IC Type:

Gain:

52.9 dB

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

27 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TL592ADR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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