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TL592BD8R

Texas Instruments

TL592BD8R by Texas Instruments

TL592BD8R by Texas Instruments is a video amplifier with 8 terminals, operating temperature range of 0-70°C, and gain of 52 dB. It is used in audio/video applications, featuring a small outline package style and max supply voltage of 8V. With a nominal bandwidth of 50 kHz, it is ideal for commercial-grade electronics requiring high-quality video amplification.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,498 parts In-Stock

1+ parts

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8,498

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Digiode

USA . 3,295 parts In-Stock

1+ parts

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3,295

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,242 parts In-Stock

1+ parts

$2.242

100+ parts

-

1k+ parts

$2.744

10k+ parts

-

2,242

$2.242

-

$2.744

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DigiPath Technology Company

USA . 1,779 parts In-Stock

1+ parts

$2.469

100+ parts

$2.271

1k+ parts

-

10k+ parts

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1,779

$2.469

$2.271

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ChromeModa Solutions

Germany . 5,373 parts In-Stock

1+ parts

$2.519

100+ parts

$2.066

1k+ parts

-

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5,373

$2.519

$2.066

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IDEA Electronic Components Group

UK . 2,231 parts In-Stock

1+ parts

$2.519

100+ parts

-

1k+ parts

$2.267

10k+ parts

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2,231

$2.519

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$2.267

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One Stop Electronics

USA . 939 parts In-Stock

1+ parts

$6.800

100+ parts

-

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939

$6.800

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AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$14.316

100+ parts

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397

$14.316

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Corphita

USA . 1,452 parts In-Stock

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1,452

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Overview

Enhance your audio and video experience with the TL592BD8R by Texas Instruments. Crafted with precision and quality, this video amplifier offers seamless integration and superior performance in a compact package. Perfect for a wide range of applications, this product delivers exceptional value with its high gain, low power consumption, and reliable design. Elevate your projects with the TL592BD8R and experience unmatched clarity and versatility that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the amplifier easy to handle and resistant to wear and tear.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape is compact and ideal for space-efficient designs in audio and video equipment.

General IC Type: VIDEO AMPLIFIER

Being a video amplifier, this product is specifically designed to enhance and boost video signals for optimal quality and clarity.

No. of Terminals: 8

Having 8 terminals provides multiple connectivity options for various input and output configurations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation in a wide range of environments.

Width: 3.9 mm

The compact width makes this amplifier suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement makes this amplifier energy-efficient and compatible with various power sources.

Maximum Seated Height: 1.75 mm

The low seated height allows for a slim profile and easy integration into small electronic devices.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures wide applicability in consumer electronics and industrial applications.

Technology: BIPOLAR

The bipolar technology used in this amplifier offers high performance and reliability in amplifying video signals.

Nominal Bandwidth: 50 kHz

The wide bandwidth allows for high-frequency video signals to be amplified with clarity and precision.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections for reliable signal transmission.

Maximum Supply Current: 27 mA

The low maximum supply current requirement ensures efficient power consumption and minimal heat dissipation.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for close spacing of terminals on PCBs, enabling compact and dense circuit designs.

Gain: 52 dB

The high gain value of 52 dB ensures strong amplification of video signals for improved audiovisual quality.

Maximum Supply Voltage (Vsup): 8 V

The moderate maximum supply voltage requirement allows for compatibility with a wide range of power sources.

Technical Specifications

Audio & Video Amplifiers TL592BD8R attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

50 kHz

General IC Type:

Gain:

52 dB

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

27 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TL592BD8R General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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