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TLV320DAC3202BYZJR

Texas Instruments

TLV320DAC3202BYZJR by Texas Instruments

TLV320DAC3202BYZJR by Texas Instruments is a 20-terminal audio amplifier with power supplies of 1.8V and 3.7V, operating b/w -30°C to 85°C. It features a plastic/epoxy package body, surface mount capability, and terminal finish of tin silver copper. Ideal for audio applications requiring high-quality amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,637 parts In-Stock

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6,637

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Digiode

USA . 4,277 parts In-Stock

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4,277

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

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Corohmni

South Africa . 76 parts In-Stock

1+ parts

$2.703

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76

$2.703

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One Stop Electronics

USA . 1,599 parts In-Stock

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$2.800

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1,599

$2.800

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Parana Technologies

USA . 2,098 parts In-Stock

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$2.917

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$3.415

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2,098

$2.917

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$3.415

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DigiPath Technology Company

USA . 2,334 parts In-Stock

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$3.211

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$2.955

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$3.211

$2.955

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IDEA Electronic Components Group

UK . 2,168 parts In-Stock

1+ parts

$3.277

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$2.949

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2,168

$3.277

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$2.949

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ChromeModa Solutions

Germany . 287 parts In-Stock

1+ parts

$3.277

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$2.687

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287

$3.277

$2.687

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Ampacity Inc.

Singapore . 363 parts In-Stock

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$8.800

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363

$8.800

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AZTECH Wire

Italy . 649 parts In-Stock

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$15.613

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649

$15.613

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Semicontronic

India . 1,492 parts In-Stock

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$19.800

100+ parts

$19.305

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$19.206

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1,492

$19.800

$19.305

$19.206

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S.R.D Solutions

India . 3,000 parts In-Stock

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Microchip USA

USA . 2,022 parts In-Stock

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Continental Prestige Electronics

USA . 1,853 parts In-Stock

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Argo Parts USA

USA . 1,814 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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300

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Corphita

USA . 178 parts In-Stock

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178

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Bastille Electronics

Australia . 63 parts In-Stock

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63

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Overview

Elevate your audio experience with the TLV320DAC3202BYZJR by Texas Instruments. Crafted with precision and expertise, this audio & video amplifier offers unparalleled quality and performance. Whether you're looking to enhance your home entertainment system or elevate your music listening experience, this product delivers crystal-clear sound and crisp visuals. With Texas Instruments' reputation for innovation and reliability, you can trust that this amplifier will exceed your expectations. Upgrade your audio setup today with the TLV320DAC3202BYZJR and immerse yourself in a world of superior sound quality and unmatched clarity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the amplifier easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on a circuit board, making the amplifier compact and efficient.

Package Shape: RECTANGULAR

The rectangular shape is a common and efficient design for electronic components, allowing for easy integration into various systems.

Power Supplies (V): 1.8,3.7

Multiple power supply options provide flexibility for different applications and ensure compatibility with various voltage requirements.

No. of Terminals: 20

Having a higher number of terminals allows for more connections and functions, making the amplifier versatile and adaptable to different setups.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style allows for a high density of components on a circuit board, increasing performance and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the amplifier can withstand demanding conditions without overheating or malfunctioning.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature means the amplifier can function reliably in cold environments or during temperature fluctuations.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring a stable electrical connection for optimal performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and maintenance procedures, making the amplifier user-friendly and easy to work with.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required for peak reflow temperature ensures efficient and reliable soldering processes during assembly, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure and durable solder joints, ensuring the amplifier's long-term reliability and performance.

Terminal Form: BALL

The ball terminal form is a reliable and efficient design for electrical connections, ensuring stable and consistent performance of the amplifier.

Terminal Pitch: 0.5 mm

The small terminal pitch enables a high density of connections on a circuit board, maximizing functionality and efficiency of the amplifier.

Technical Specifications

Audio & Video Amplifiers TLV320DAC3202BYZJR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.7

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TLV320DAC3202BYZJR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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