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TLV320AIC3107IYZFR

Texas Instruments

TLV320AIC3107IYZFR by Texas Instruments

TLV320AIC3107IYZFR by Texas Instruments is an audio amplifier IC with 2 channels and 1.77% harmonic distortion. It operates in industrial temperature range (-40 to 85°C) with power supplies of 1.8-3.3V, suitable for audio and video amplification applications. Package style includes grid array, very thin profile, fine pitch design for surface mount assembly.

Median Price

$3.359

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 57,045 parts In-Stock

1+ parts

$3.743

100+ parts

$3.280

1k+ parts

$1.853

10k+ parts

-

57,045

$3.743

$3.280

$1.853

-

Rochester

USA . 167,828 parts In-Stock

1+ parts

-

100+ parts

$2.660

1k+ parts

$2.380

10k+ parts

$2.240

167,828

-

$2.660

$2.380

$2.240

DigiKey

USA . 103,323 parts In-Stock

1+ parts

-

100+ parts

$4.580

1k+ parts

-

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103,323

-

$4.580

-

-

Verical

USA . 58,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.975

10k+ parts

$2.800

58,941

-

-

$2.975

$2.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 619 parts In-Stock

1+ parts

$2.442

100+ parts

-

1k+ parts

-

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619

$2.442

-

-

-

Vyrian

USA . 4,505 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

-

4,505

$2.570

-

-

-

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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3,000

-

-

-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,531 parts In-Stock

1+ parts

-

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1,531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 77,497 parts In-Stock

1+ parts

$2.180

100+ parts

-

1k+ parts

-

10k+ parts

-

77,497

$2.180

-

-

-

Corphita

USA . 3,415 parts In-Stock

1+ parts

$2.313

100+ parts

-

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-

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3,415

$2.313

-

-

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Parana Technologies

USA . 1,486 parts In-Stock

1+ parts

$2.469

100+ parts

-

1k+ parts

$2.962

10k+ parts

-

1,486

$2.469

-

$2.962

-

DigiPath Technology Company

USA . 2,026 parts In-Stock

1+ parts

$2.719

100+ parts

$2.501

1k+ parts

-

10k+ parts

-

2,026

$2.719

$2.501

-

-

ChromeModa Solutions

Germany . 4,475 parts In-Stock

1+ parts

$2.774

100+ parts

$2.275

1k+ parts

-

10k+ parts

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4,475

$2.774

$2.275

-

-

IDEA Electronic Components Group

UK . 398 parts In-Stock

1+ parts

$2.774

100+ parts

-

1k+ parts

$2.497

10k+ parts

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398

$2.774

-

$2.497

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Lixinc

USA . 9,181 parts In-Stock

1+ parts

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9,181

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 4,821 parts In-Stock

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4,821

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Perfect Parts

USA . 3,956 parts In-Stock

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3,956

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

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Kepictronics

USA . 750 parts In-Stock

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750

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Microchip USA

USA . 167 parts In-Stock

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167

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Overview

Elevate your audio experience with the TLV320AIC3107IYZFR by Texas Instruments. Crafted with precision and expertise, this audio amplifier delivers unmatched quality and performance. Perfect for a wide range of applications, this product offers crystal-clear sound and reliable power supplies for seamless operation. With a sleek rectangular design and top-notch features, customers can expect nothing but excellence from this innovative solution. Upgrade your audio systems today with the TLV320AIC3107IYZFR and immerse yourself in a world of superior sound quality. Elevate your listening experience like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for a smaller and more compact design, saving space and making installation easier.

Package Shape: RECTANGULAR

Rectangular package shape is efficient for maximizing space utilization on a circuit board.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Harmonic Distortion: 1.77%

Low harmonic distortion results in clearer audio with minimal unwanted noise or interference.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages to accommodate different systems and configurations.

No. of Terminals: 42

Higher number of terminals allow for more connections and versatility in connecting to other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The package style provides a compact design with precise pitch for optimal performance in audio applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both extreme hot and cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the circuit board.

Maximum Seated Height: 0.625 mm

Low seated height allows for a slimmer and more streamlined overall design.

Width: 3.346 mm

Compact width contributes to a space-saving layout on the circuit board.

Minimum Supply Voltage (Vsup): 1.525 V

Low minimum supply voltage requirement enables operation in low power situations.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures thorough soldering and reliability in manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability supports lead-free soldering and manufacturing processes.

Length: 3.533 mm

The length of the product is optimized for a compact and efficient design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

No. of Channels: 2

Dual-channel design provides stereo sound output for a more immersive audio experience.

Nominal Bandwidth: 0.02 kHz

Wide nominal bandwidth supports a range of audio frequencies for versatile use.

Terminal Form: BALL

Ball terminal form enables easy and reliable connection to the circuit board.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise and compact mounting on the circuit board.

Maximum Supply Voltage (Vsup): 1.95 V

High maximum supply voltage ensures compatibility with a wide range of power sources.

Technical Specifications

Audio & Video Amplifiers TLV320AIC3107IYZFR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES ANALOG SUPPLY OF 3.3V

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

1.77 %

JESD-30 Code:

R-XBGA-B42

JESD-609 Code:

e1

Length:

3.533 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA42,6X7,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.525 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.346 mm

Trade Compliance

TLV320AIC3107IYZFR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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