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TDA8950J/N1

NXP Semiconductors

TDA8950J/N1 by NXP Semiconductors

TDA8950J/N1 by NXP Semiconductors is an audio amplifier IC with +-35V power supplies, 23 terminals, and 75mA max supply current. It is designed for industrial applications requiring high-quality audio amplification in a rectangular plastic/epoxy package style. Operating temperatures range from -40°C to 85°C, making it suitable for various audio and video amplifier needs.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 3,440 parts In-Stock

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Anansix

USA . 2,814 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Corohmni

South Africa . 394 parts In-Stock

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$1.005

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Aztec Data Supply Inc.

USA . 3,398 parts In-Stock

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Ampacity Inc.

Singapore . 133 parts In-Stock

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$14.800

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AZTECH Wire

Italy . 672 parts In-Stock

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One Stop Electronics

USA . 846 parts In-Stock

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Lixinc

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Continental Prestige Electronics

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Argo Parts USA

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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GreenTree Electronics

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Advanced Electronics

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Bastille Electronics

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Overview

Elevate your audio experience with the TDA8950J/N1 from NXP Semiconductors. Known for their high-quality products, NXP Semiconductors delivers top-notch performance in the Audio & Video Amplifiers category. Perfect for industrial applications, this audio amplifier offers a temperature range of -40 to 85°C, ensuring reliable operation in any environment. With a terminal pitch of 1.27mm and a maximum supply current of 75mA, this product provides unmatched value and benefits to customers looking for superior audio amplification. Upgrade your sound system today with the TDA8950J/N1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and circuit layouts, making it versatile for different applications.

General IC Type: AUDIO AMPLIFIER

Specifically designed as an audio amplifier, ensuring high-quality sound output and performance for audio applications.

Power Supplies (V): +-35

With a power supply range of +-35V, this amplifier can handle a wide range of input voltages, making it suitable for various power sources.

No. of Terminals: 23

Multiple terminals allow for flexible input and output connections, expanding the usability of the amplifier for different setups.

Terminal Position: ZIG-ZAG

Zig-zag terminal layout helps in easy soldering and provides a secure connection, ensuring reliability in the amplifier's performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation even in cold environments, ensuring versatility in different operating conditions.

Maximum Supply Current: 75 mA

With a maximum supply current of 75mA, this amplifier can handle a decent amount of power, making it suitable for various audio applications.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact design and space-saving layout, making it suitable for smaller electronic devices and circuit boards.

Technical Specifications

Audio & Video Amplifiers TDA8950J/N1 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T23

No. of Terminals:

23

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP23,.2,.17

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-35

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

75 mA

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8950J/N1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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