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TDA8541T/N1/G,118

NXP Semiconductors

TDA8541T/N1/G,118 by NXP Semiconductors

TDA8541T/N1/G,118 by NXP Semiconductors is an audio amplifier IC with 10% harmonic distortion and 1.2W nominal output power. It operates b/w -40 to 85°C, suitable for industrial applications in small outline packages. With a gain of 20dB and operating voltage range from 2.2V to 18V, it's ideal for compact audio systems requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 806 parts In-Stock

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Digiode

USA . 474 parts In-Stock

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Anansix

USA . 151 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Corohmni

South Africa . 68 parts In-Stock

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$0.246

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$0.246

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Aztec Data Supply Inc.

USA . 1,396 parts In-Stock

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$2.710

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One Stop Electronics

USA . 1,273 parts In-Stock

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$2.800

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$2.800

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Ampacity Inc.

Singapore . 1,329 parts In-Stock

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$5.800

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$5.800

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Semicontronic

India . 205 parts In-Stock

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$9.800

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$9.555

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$9.506

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205

$9.800

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AZTECH Wire

Italy . 432 parts In-Stock

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$10.735

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Argo Parts USA

USA . 4,527 parts In-Stock

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Continental Prestige Electronics

USA . 2,961 parts In-Stock

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Corphita

USA . 1,768 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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UNI Independent Distributors

Spain . 282 parts In-Stock

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Overview

Elevate your audio experience with the TDA8541T/N1/G,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality audio & video amplifiers that are perfect for a wide range of applications. With its compact design and high-performance capabilities, this audio amplifier offers customers exceptional value, superior benefits, and unmatched advantages. Upgrade your sound system today with the TDA8541T/N1/G,118 and enjoy crystal-clear audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to wear and tear.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Nominal Output Power: 1.2 W

Sufficient power output for amplifying audio signals to a desirable level without distortion.

Nominal Bandwidth: 0.02 kHz

Provides a wide range of frequencies that can be amplified, allowing for versatile audio applications.

Maximum Supply Voltage (Vsup): 18 V

Can handle higher voltages, providing flexibility in power supply options.

Technical Specifications

Audio & Video Amplifiers TDA8541T/N1/G,118 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

20 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.2 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA8541T/N1/G,118 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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