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TDA8954TH/N1,112

NXP Semiconductors

TDA8954TH/N1,112 by NXP Semiconductors

NXP Semiconductors TDA8954TH/N1,112 is a dual-function audio amplifier with +-41V power supplies. It has 24 terminals, operates b/w -40 to 85°C, and draws a max supply current of 75mA. This industrial-grade IC in small outline package is ideal for audio and video amplification applications.

Median Price

$5.808

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.808

100+ parts

-

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100

$5.808

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Vyrian

USA . 4,967 parts In-Stock

1+ parts

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4,967

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Digiode

USA . 2,928 parts In-Stock

1+ parts

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2,928

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Anansix

USA . 875 parts In-Stock

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875

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,027 parts In-Stock

1+ parts

$0.102

100+ parts

$0.102

1k+ parts

$0.102

10k+ parts

-

2,027

$0.102

$0.102

$0.102

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Aztec Data Supply Inc.

USA . 2,885 parts In-Stock

1+ parts

$1.660

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2,885

$1.660

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Corohmni

South Africa . 826 parts In-Stock

1+ parts

$2.335

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826

$2.335

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$4.108

100+ parts

$3.738

1k+ parts

$3.369

10k+ parts

-

200

$4.108

$3.738

$3.369

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Continental Prestige Electronics

USA . 2,773 parts In-Stock

1+ parts

$5.808

100+ parts

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10k+ parts

$5.692

2,773

$5.808

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-

$5.692

Semicontronic

India . 1,018 parts In-Stock

1+ parts

$8.800

100+ parts

$8.580

1k+ parts

$8.536

10k+ parts

-

1,018

$8.800

$8.580

$8.536

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One Stop Electronics

USA . 1,164 parts In-Stock

1+ parts

$11.800

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1,164

$11.800

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Ampacity Inc.

Singapore . 1,425 parts In-Stock

1+ parts

$16.800

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1,425

$16.800

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AZTECH Wire

Italy . 290 parts In-Stock

1+ parts

$19.710

100+ parts

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290

$19.710

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Component Stockers USA

USA . 700 parts In-Stock

1+ parts

$99.990

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700

$99.990

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UNI Independent Distributors

Spain . 5,761 parts In-Stock

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5,761

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Microchip USA

USA . 5,616 parts In-Stock

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5,616

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Robosynatics

Brazil . 3,995 parts In-Stock

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3,995

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Lucentia Tech

USA . 3,995 parts In-Stock

1+ parts

-

100+ parts

$2.522

1k+ parts

$2.470

10k+ parts

$2.470

3,995

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$2.522

$2.470

$2.470

Argo Parts USA

USA . 1,784 parts In-Stock

1+ parts

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1,784

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Perfect Parts

USA . 1,781 parts In-Stock

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1,781

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Corphita

USA . 758 parts In-Stock

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758

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Overview

Enhance your audio experience with the TDA8954TH/N1,112 from NXP Semiconductors. As a leader in the industry, NXP delivers top-quality audio and video amplifiers that are reliable and efficient. This small outline, shrink pitch package is perfect for industrial-grade applications, offering peak performance even in extreme temperatures. With dual terminal position and gull wing form, this audio amplifier provides clear, powerful sound with minimal distortion. Elevate your audio projects with the TDA8954TH/N1,112 and enjoy superior quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable amplifier suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and space.

No. of Functions: 2

With two functions in one amplifier, this product offers versatility and flexibility in audio amplification.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into different electronic designs.

General IC Type: AUDIO AMPLIFIER

This specific IC type is ideal for amplifying audio signals with high quality and clarity.

Power Supplies (V): +-41

Supports power supplies of up to +-41V, making it suitable for various audio amplification requirements.

No. of Terminals: 24

With 24 terminals, this amplifier offers ample connectivity options for different audio devices.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style enhances space-saving on circuit boards.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this amplifier can withstand high heat conditions.

Minimum Operating Temperature: -40 °C

The amplifier can function efficiently even in extreme cold temperatures as low as -40°C.

Terminal Position: DUAL

Dual terminal positioning provides stability and reliability in connecting the amplifier to external devices.

Peak Reflow Temperature °C: 225

The high peak reflow temperature ensures secure soldering during assembly processes.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, ensuring reliable performance in harsh environments.

Terminal Form: GULL WING

The gull wing terminal form offers a secure and robust connection for long-term use.

Maximum Supply Current: 75 mA

With a maximum supply current of 75mA, this amplifier operates efficiently without drawing excessive power.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for easy and precise installation on circuit boards.

Technical Specifications

Audio & Video Amplifiers TDA8954TH/N1,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.56,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

225

Power Supplies (V):

+-41

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

75 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

TDA8954TH/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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