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TDA8932BTW

NXP Semiconductors

TDA8932BTW by NXP Semiconductors

The NXP Semiconductors TDA8932BTW is a 55W audio amplifier IC with 2 channels, operating at temperatures from -40 to 85°C. It has a gain of 36dB and requires a supply voltage b/w 5-18V. This compact rectangular package is ideal for industrial audio and video applications requiring high power output in a small form factor.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Anansix

USA . 2,414 parts In-Stock

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Vyrian

USA . 759 parts In-Stock

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Digiode

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Century Electronics Ltd.

USA . 300 parts In-Stock

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300

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Nova Conductors

Japan . 87 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 13 parts In-Stock

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Aztec Data Supply Inc.

USA . 107 parts In-Stock

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$0.590

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One Stop Electronics

USA . 1,486 parts In-Stock

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$3.800

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Corohmni

South Africa . 1,249 parts In-Stock

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Ampacity Inc.

Singapore . 206 parts In-Stock

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AZTECH Wire

Italy . 894 parts In-Stock

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Lixinc

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Continental Prestige Electronics

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Kepictronics

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A-Z Elektronik GmbH

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Corphita

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Authorized Procurement Solutions

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Argo Parts USA

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UNI Independent Distributors

Spain . 950 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Elevate your audio experience with the TDA8932BTW by NXP Semiconductors, a top-of-the-line audio amplifier designed for high-quality sound performance. Manufactured with precision and expertise, this small outline, heat sink-equipped amplifier offers 55W of power and a nominal output power of 55W, ensuring crystal-clear sound in a compact package. Ideal for a wide range of applications, from home entertainment systems to automotive audio setups, the TDA8932BTW delivers exceptional value and performance. Upgrade your audio setup today and immerse yourself in superior sound quality with this innovative amplifier from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the amplifier lightweight and durable, ideal for portable audio equipment.

Surface Mount: YES

Being surface mountable allows for easy integration into compact electronics, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures efficient use of board space, making the amplifier suitable for small form factor designs.

General IC Type: AUDIO AMPLIFIER

With a specific focus on audio amplification, this product delivers high-quality sound performance, making it perfect for audio applications.

Power Supplies (V): 22

With a supply voltage of 22V, this amplifier can deliver high power output, making it suitable for driving speakers in a variety of audio setups.

No. of Terminals: 32

The ample number of terminals provides flexibility for connecting various components, allowing for customization and versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The compact package style with built-in heat sink and thin profile enhances thermal management and enables efficient heat dissipation, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the amplifier can withstand demanding conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the amplifier to operate reliably in extreme cold environments, expanding its application in diverse settings.

Terminal Finish: Tin (Sn)

The use of tin as the terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: DUAL

The dual terminal position design facilitates easy connection and integration into the circuit, offering convenience during installation and assembly.

Nominal Output Power: 55 W

With a nominal output power of 55W, this amplifier is capable of delivering high power audio signals, suitable for driving loudspeakers and audio systems with clarity and precision.

Technical Specifications

Audio & Video Amplifiers TDA8932BTW attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 10V TO 36V SINGLE SUPPLY

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

36 dB

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

55 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

22

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

TDA8932BTW General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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