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TAS5631BPHDR

Texas Instruments

TAS5631BPHDR by Texas Instruments

TAS5631BPHDR by Texas Instruments is a 300W audio amplifier IC with 2 channels. Operating at 12-50V, it has a noise figure of 103dB and operates in commercial temperature range. Suitable for audio applications, it comes in a square package with surface mount capability.

Median Price

$14.787

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,553 parts In-Stock

1+ parts

$10.964

100+ parts

$9.577

1k+ parts

$6.605

10k+ parts

-

3,553

$10.964

$9.577

$6.605

-

Mouser Electronics

USA . 806 parts In-Stock

1+ parts

$18.610

100+ parts

$12.730

1k+ parts

$11.910

10k+ parts

-

806

$18.610

$12.730

$11.910

-

Distributors (In-Stock)

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Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$8.256

100+ parts

-

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52

$8.256

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-

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Digiode

USA . 1,398 parts In-Stock

1+ parts

$10.416

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-

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1,398

$10.416

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Vyrian

USA . 8,117 parts In-Stock

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8,117

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Chip Stock

USA . 625 parts In-Stock

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625

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Distributors (Availability)

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Parana Technologies

USA . 1,971 parts In-Stock

1+ parts

$0.561

100+ parts

-

1k+ parts

$1.659

10k+ parts

-

1,971

$0.561

-

$1.659

-

DigiPath Technology Company

USA . 157 parts In-Stock

1+ parts

$0.617

100+ parts

$0.568

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-

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157

$0.617

$0.568

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ChromeModa Solutions

Germany . 5,082 parts In-Stock

1+ parts

$0.630

100+ parts

$0.517

1k+ parts

-

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5,082

$0.630

$0.517

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IDEA Electronic Components Group

UK . 1,470 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

$0.567

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1,470

$0.630

-

$0.567

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Continental Prestige Electronics

USA . 5,420 parts In-Stock

1+ parts

$8.256

100+ parts

-

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$8.091

5,420

$8.256

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$8.091

Ampacity Inc.

Singapore . 1,998 parts In-Stock

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$9.320

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-

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1,998

$9.320

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Corphita

USA . 3,545 parts In-Stock

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$9.868

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3,545

$9.868

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Lixinc

USA . 14,287 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,206 parts In-Stock

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Argo Parts USA

USA . 3,982 parts In-Stock

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Perfect Parts

USA . 3,508 parts In-Stock

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3,508

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

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1,000

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Futuretech Components

Singapore . 260 parts In-Stock

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260

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Kepictronics

USA . 41 parts In-Stock

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41

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Bastille Electronics

Australia . 22 parts In-Stock

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22

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Overview

Unleash the power of sound with the TAS5631BPHDR from Texas Instruments. Designed for audio enthusiasts and professionals alike, this high-quality audio amplifier delivers unparalleled performance and crystal-clear sound reproduction. Perfect for a wide range of applications in the audio and video industry, this device offers a seamless blend of cutting-edge technology and reliability. Elevate your listening experience with the TAS5631BPHDR and immerse yourself in the ultimate audio experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and longevity to the product, ensuring it can withstand everyday wear and tear.

Power Supplies (V): 12,50

Suitable voltage for powering the amplifier, ensuring optimal performance.

Nominal Output Power: 300 W

High power output allows for loud and clear audio amplification, making it perfect for various applications.

Nominal Noise Figure: 103 dB

Provides high signal-to-noise ratio, ensuring clear and crisp audio output with minimal interference.

Temperature Grade: COMMERCIAL

Suitable for use in commercial settings, ensuring reliability and consistent performance.

Technical Specifications

Audio & Video Amplifiers TAS5631BPHDR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

Nominal Noise Figure:

103 dB

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

300 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12,50

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TAS5631BPHDR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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