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TDA8950TH/N1

NXP Semiconductors

TDA8950TH/N1 by NXP Semiconductors

TDA8950TH/N1 by NXP Semiconductors is an audio amplifier IC with +-35V power supplies, 24 terminals, and 75mA max supply current. It is designed for industrial applications, operates b/w -40°C to 85°C, and comes in a small outline package suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,098 parts In-Stock

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Chip Stock

USA . 935 parts In-Stock

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935

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Vyrian

USA . 921 parts In-Stock

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921

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Anansix

USA . 495 parts In-Stock

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495

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Nova Conductors

Japan . 90 parts In-Stock

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90

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,047 parts In-Stock

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$2.100

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4,047

$2.100

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Ampacity Inc.

Singapore . 722 parts In-Stock

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$14.800

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722

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AZTECH Wire

Italy . 813 parts In-Stock

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$15.754

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813

$15.754

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One Stop Electronics

USA . 1,501 parts In-Stock

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$17.800

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$17.800

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UNI Independent Distributors

Spain . 7,443 parts In-Stock

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Continental Prestige Electronics

USA . 4,846 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Argo Parts USA

USA . 1,450 parts In-Stock

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ChipstoGo Electronic ltd

UK . 1,293 parts In-Stock

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Corphita

USA . 1,068 parts In-Stock

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Lixinc

USA . 463 parts In-Stock

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463

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A-Z Elektronik GmbH

Germany . 305 parts In-Stock

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305

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Corohmni

South Africa . 18 parts In-Stock

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Overview

Enhance your audio experience with the TDA8950TH/N1 by NXP Semiconductors, a high-quality audio amplifier that delivers superior sound performance. Manufactured by industry leader NXP Semiconductors, this product is designed for a wide range of applications in audio and video systems. With its compact size and advanced technology, the TDA8950TH/N1 offers customers exceptional value, benefits, and advantages. Elevate your audio projects with this powerful amplifier and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body ensures durability and protection for the internal components, making this amplifier a reliable choice.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into various audio and video systems, making this amplifier versatile and convenient to use.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient and space-saving installation in different devices, making this amplifier a practical choice for compact setups.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output and performance, making this product ideal for enhancing audio experiences.

Power Supplies (V): +-35

With a power supply range of +-35V, this amplifier can handle a wide range of input voltages, ensuring compatibility with different power sources for consistent performance.

No. of Terminals: 24

The ample number of terminals allows for easy connections and flexibility in wiring configurations, making this amplifier versatile and adaptable for various setups.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space and enhances portability, making this amplifier a suitable choice for smaller devices and installations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this amplifier can withstand extended use and high temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this amplifier to function in cold environments without any issues, making it a dependable choice for diverse settings.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and wiring options, allowing for customized setups and easy integration, making this amplifier a versatile solution.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this amplifier is built to withstand tough conditions and deliver consistent performance, making it a reliable choice for demanding environments.

Terminal Form: GULL WING

The gull wing terminal form ensures secure connections and stability, reducing the risk of loose connections or interference, making this amplifier a dependable choice for audio and video setups.

Maximum Supply Current: 75 mA

With a maximum supply current of 75mA, this amplifier operates efficiently and conserves power without compromising performance, making it a cost-effective and energy-efficient choice.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for precise and secure connections, ensuring stable performance and compatibility with various devices, making this amplifier a reliable and user-friendly option.

Technical Specifications

Audio & Video Amplifiers TDA8950TH/N1 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.56,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

+-35

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

75 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

TDA8950TH/N1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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