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TDA7052

NXP Semiconductors

TDA7052 by NXP Semiconductors

The NXP Semiconductors TDA7052 is an audio amplifier IC with 1% harmonic distortion, 1.2W output power, and 39dB gain. It operates b/w -40 to 85°C, requires a supply voltage of 3-18V, and has a bandwidth of 0.02 kHz. Ideal for industrial applications requiring compact audio amplification in a rectangular package style.

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Fibra_Brandt Electronic GMBH

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Lantek

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Odintec Ltd.

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Nova Conductors

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Corel Iberica Componentes, S.L.

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ABC Electronics Ltd.

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AZTECH Wire

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Overview

Upgrade your audio experience with the TDA7052 by NXP Semiconductors. This high-quality audio amplifier delivers crisp sound and powerful performance, making it ideal for a wide range of applications. From handheld devices to home entertainment systems, this compact and reliable IC offers 1.2W of output power and minimal harmonic distortion. With NXP's reputation for excellence in semiconductor technology, you can trust that the TDA7052 will exceed your expectations. Experience superior audio quality and seamless integration with the TDA7052 - your go-to choice for audio amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable use or installations where weight is a concern.

Nominal Output Power: 1.2 W

With a nominal output power of 1.2W, this amplifier is suitable for small to medium-sized audio applications, providing enough power for clear and crisp sound output.

Harmonic Distortion: 1 %

The low harmonic distortion of 1% ensures that the audio signal remains clean and distortion-free, resulting in high-quality sound reproduction.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the amplifier can operate reliably in a wide range of temperatures, making it suitable for industrial and commercial applications.

Gain: 39 dB

With a gain of 39 dB, this amplifier can boost the input signal significantly without introducing noise or distortion, enhancing the overall audio performance.

Technical Specifications

Audio & Video Amplifiers TDA7052 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

39 dB

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.2 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

6

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7052 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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