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TDA1308T/N1,115

NXP Semiconductors

TDA1308T/N1,115 by NXP Semiconductors

TDA1308T/N1,115 by NXP Semiconductors is a dual-channel audio amplifier IC with a power supply range of 1.5V to 3.5V and max output power of 0.06W. It operates in industrial temperature grades from -40°C to 85°C, making it suitable for various audio applications requiring small outline packages and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,927 parts In-Stock

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4,927

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Anansix

USA . 2,209 parts In-Stock

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2,209

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Vyrian

USA . 468 parts In-Stock

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468

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Distributors (Availability)

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Corohmni

South Africa . 349 parts In-Stock

1+ parts

$0.262

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349

$0.262

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Aztec Data Supply Inc.

USA . 1,348 parts In-Stock

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$3.210

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$3.210

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Ampacity Inc.

Singapore . 1,566 parts In-Stock

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$6.800

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$6.800

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One Stop Electronics

USA . 1,376 parts In-Stock

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$6.800

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$6.800

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Semicontronic

India . 1,116 parts In-Stock

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$7.800

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$7.605

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$7.566

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1,116

$7.800

$7.605

$7.566

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AZTECH Wire

Italy . 729 parts In-Stock

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$18.033

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729

$18.033

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Argo Parts USA

USA . 4,997 parts In-Stock

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4,997

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Continental Prestige Electronics

USA . 4,095 parts In-Stock

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UNI Independent Distributors

Spain . 3,460 parts In-Stock

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Corphita

USA . 1,935 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Advanced Electronics

New Zealand . 61 parts In-Stock

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61

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Overview

Enhance your audio experience with the NXP Semiconductors TDA1308T/N1,115 Audio Amplifier. Crafted with precision and expertise, this small outline package delivers high-quality sound amplification for a wide range of applications. Whether you're upgrading your home entertainment system or designing innovative audio products, this amplifier offers exceptional value, efficiency, and performance. Elevate your audio projects with the reliable and versatile TDA1308T/N1,115 from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and simplifying the assembly process.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier, this product is specifically designed to enhance and amplify sound signals, making it ideal for audio applications.

Nominal Output Power: 0.06 W

With a nominal output power of 0.06W, this amplifier can efficiently boost audio signals, providing clear and quality sound output.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

No. of Channels: 2

Having 2 channels allows for stereo audio output, enhancing the overall audio experience and providing better sound separation.

Technology: CMOS

The use of CMOS technology ensures low power consumption and efficient operation, making it an energy-efficient choice.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage requirement of 1.5V allows for flexibility in powering the amplifier and compatibility with a variety of systems.

Technical Specifications

Audio & Video Amplifiers TDA1308T/N1,115 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.06 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA1308T/N1,115 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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