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TPA721DGNRG4

Texas Instruments

TPA721DGNRG4 by Texas Instruments

TPA721DGNRG4 by Texas Instruments is an audio amplifier with 0.7W output power, 2.5mA supply current, and 2dB gain. It operates b/w -40 to 85°C, suitable for industrial applications requiring small outline package with surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,356 parts In-Stock

1+ parts

-

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3,356

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Digiode

USA . 254 parts In-Stock

1+ parts

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254

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Nova Conductors

Japan . 35 parts In-Stock

1+ parts

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35

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 620 parts In-Stock

1+ parts

$2.050

100+ parts

$190.343

1k+ parts

$1.845

10k+ parts

-

620

$2.050

$190.343

$1.845

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DigiPath Technology Company

USA . 961 parts In-Stock

1+ parts

$2.257

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961

$2.257

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ChromeModa Solutions

Germany . 3,588 parts In-Stock

1+ parts

$2.303

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$1.888

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3,588

$2.303

$1.888

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IDEA Electronic Components Group

UK . 2,259 parts In-Stock

1+ parts

$2.303

100+ parts

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$2.073

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2,259

$2.303

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$2.073

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Ampacity Inc.

Singapore . 174 parts In-Stock

1+ parts

$10.800

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174

$10.800

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One Stop Electronics

USA . 796 parts In-Stock

1+ parts

$12.800

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796

$12.800

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AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$19.290

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828

$19.290

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Continental Prestige Electronics

USA . 6,033 parts In-Stock

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6,033

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A-Z Elektronik GmbH

Germany . 5,048 parts In-Stock

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5,048

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Corphita

USA . 4,650 parts In-Stock

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4,650

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Argo Parts USA

USA . 3,878 parts In-Stock

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Kepictronics

USA . 1,300 parts In-Stock

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1,300

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your audio experience with the TPA721DGNRG4 by Texas Instruments. Manufactured with precision and expertise, this audio amplifier delivers unparalleled quality and performance. Whether you're looking to enhance your portable speakers, headphones, or home entertainment systems, this small outline, heat sink package guarantees clear sound and minimal distortion. With a nominal output power of 0.7W and a low harmonic distortion of 0.5%, the TPA721DGNRG4 offers exceptional value and reliability. Upgrade your audio devices today and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight design, making it a convenient choice for various audio and video amplifier applications.

Surface Mount: YES

With surface mount capability, this amplifier can be easily mounted on PCBs, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for applications where space is limited.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output, making it a reliable choice for audio applications.

Harmonic Distortion: 0.5 %

With low harmonic distortion of 0.5%, this amplifier delivers clear and accurate audio output, perfect for high-fidelity audio systems.

No. of Terminals: 8

The amplifier's 8 terminals offer flexibility in connectivity options, making it versatile for different audio setups.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The unique package style ensures efficient heat dissipation, compact size, and compatibility with various mounting options, enhancing performance and integration capabilities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this amplifier is suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connecting the amplifier, ensuring reliable signal transmission.

Nominal Output Power: 0.7 W

The amplifier's nominal output power of 0.7W delivers sufficient audio power for small to medium-sized speakers or headphones.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a compact design, suitable for slim and portable audio devices.

Width: 3 mm

The 3mm width offers a slim profile, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.5 V

With a minimum supply voltage of 2.5V, this amplifier can operate efficiently with lower power sources, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and durable solder joints.

Length: 3 mm

The 3mm length offers a compact size, suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in a wide range of operating temperatures, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this amplifier offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Nominal Bandwidth: 0.004 kHz

The nominal bandwidth of 0.004 kHz allows for accurate frequency response, ideal for audio applications requiring precise sound reproduction.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and ease of soldering during assembly.

Maximum Supply Current: 2.5 mA

With a maximum supply current of 2.5mA, this amplifier operates efficiently and conserves power for extended battery life.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch offers precise spacing for easy PCB layout and soldering, ensuring a reliable electrical connection.

Gain: 2 dB

The 2dB gain boosts the input audio signal, enhancing the output volume and clarity for an improved listening experience.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with various power sources, making it versatile for different audio systems.

Technical Specifications

Audio & Video Amplifiers TPA721DGNRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.004 kHz

General IC Type:

Gain:

2 dB

Harmonic Distortion:

.5 %

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.7 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA721DGNRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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