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TPA701DGNRG4

Texas Instruments

TPA701DGNRG4 by Texas Instruments

TPA701DGNRG4 by Texas Instruments is an audio amplifier with a nominal output power of 0.7W and harmonic distortion of 0.5%. It operates in industrial temperature grade range from -40 to 85°C, making it suitable for various audio and video applications requiring high-quality sound amplification in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,546 parts In-Stock

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8,546

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Digiode

USA . 2,583 parts In-Stock

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2,583

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Nova Conductors

Japan . 56 parts In-Stock

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56

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Distributors (Availability)

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Parana Technologies

USA . 256 parts In-Stock

1+ parts

$2.798

100+ parts

-

1k+ parts

$3.283

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256

$2.798

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$3.283

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DigiPath Technology Company

USA . 1,082 parts In-Stock

1+ parts

$3.081

100+ parts

$2.835

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1,082

$3.081

$2.835

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ChromeModa Solutions

Germany . 5,034 parts In-Stock

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$3.144

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$2.578

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5,034

$3.144

$2.578

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IDEA Electronic Components Group

UK . 1,477 parts In-Stock

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$3.144

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$2.830

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1,477

$3.144

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$2.830

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One Stop Electronics

USA . 399 parts In-Stock

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$5.800

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399

$5.800

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Ampacity Inc.

Singapore . 312 parts In-Stock

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$7.800

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312

$7.800

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AZTECH Wire

Italy . 199 parts In-Stock

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$9.250

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199

$9.250

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A-Z Elektronik GmbH

Germany . 7,924 parts In-Stock

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Argo Parts USA

USA . 4,053 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,600 parts In-Stock

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Corphita

USA . 1,033 parts In-Stock

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Kepictronics

USA . 830 parts In-Stock

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830

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Elevate your audio experience with the TPA701DGNRG4 by Texas Instruments, a top-of-the-line audio amplifier designed for superior performance and reliability. Crafted with precision and expertise by one of the industry's leading manufacturers, this innovative product is perfect for a wide range of applications in the audio and video realm. Offering unparalleled value and benefits, the TPA701DGNRG4 delivers crisp, clear sound with minimal distortion, making it a must-have for audio enthusiasts and professionals alike. Upgrade your audio setup today and enjoy the unmatched quality and advantages that this exceptional product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and lightweight construction, making the amplifier easy to handle and transport.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, ensuring high-quality sound output for audio applications.

Nominal Output Power: 0.7 W

The amplifier offers a sufficient output power of 0.7W, making it suitable for small to medium-sized audio systems.

Maximum Operating Temperature: 85 °C

The amplifier can operate at temperatures up to 85°C, ensuring reliable performance even in demanding conditions.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement of 2.5V enables the amplifier to be powered by a wide range of sources.

Technical Specifications

Audio & Video Amplifiers TPA701DGNRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.004 kHz

General IC Type:

Harmonic Distortion:

.5 %

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.7 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

.25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA701DGNRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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