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TPA751DG4

Texas Instruments

TPA751DG4 by Texas Instruments

TPA751DG4 by Texas Instruments is an audio amplifier IC with 0.5% harmonic distortion, 3/5V power supplies, and 0.35W nominal output power. It is a CMOS technology device in a small outline package for industrial applications requiring high-quality audio amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,364 parts In-Stock

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8,364

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Digiode

USA . 3,911 parts In-Stock

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3,911

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,102 parts In-Stock

1+ parts

$0.624

100+ parts

-

1k+ parts

$1.693

10k+ parts

-

1,102

$0.624

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$1.693

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DigiPath Technology Company

USA . 329 parts In-Stock

1+ parts

$0.687

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-

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329

$0.687

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ChromeModa Solutions

Germany . 2,142 parts In-Stock

1+ parts

$0.701

100+ parts

$0.575

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2,142

$0.701

$0.575

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IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$0.701

100+ parts

-

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$0.631

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709

$0.701

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$0.631

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Ampacity Inc.

Singapore . 1,423 parts In-Stock

1+ parts

$5.800

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1,423

$5.800

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AZTECH Wire

Italy . 608 parts In-Stock

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$7.827

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608

$7.827

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One Stop Electronics

USA . 1,572 parts In-Stock

1+ parts

$14.800

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1,572

$14.800

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Continental Prestige Electronics

USA . 4,419 parts In-Stock

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Corphita

USA . 3,475 parts In-Stock

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3,475

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Argo Parts USA

USA . 1,395 parts In-Stock

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1,395

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience unparalleled sound quality with the TPA751DG4 by Texas Instruments, a leading manufacturer in the audio and video amplifiers category. This audio amplifier offers superior performance, low harmonic distortion, and a wide range of applications. With a compact design and high reliability, this product is perfect for various industrial settings. Upgrade your audio experience today with the TPA751DG4 and enjoy clear, crisp sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the amplifier lightweight and durable.

Surface Mount: YES

Being surface mountable, this amplifier can be easily integrated into compact and space-constrained audio/video devices.

General IC Type: AUDIO AMPLIFIER

Specifically designed as an audio amplifier ensures optimal performance in amplifying audio signals.

Nominal Output Power: 0.35 W

With a nominal output power of 0.35W, this amplifier is suitable for small to medium-sized audio applications.

Minimum Supply Voltage (Vsup): 2.5V

The low minimum supply voltage requirement allows for flexibility in power supply options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding environments.

Technical Specifications

Audio & Video Amplifiers TPA751DG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

DEVICE FEATURES SHUTDOWN MODE FOR POWER SENSITIVE APPLICATIONS

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

.5 %

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.35 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TPA751DG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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