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TPA711DRG4

Texas Instruments

TPA711DRG4 by Texas Instruments

TPA711DRG4 by Texas Instruments is an audio amplifier with 0.3% harmonic distortion, 3.3/5V power supplies, and 0.35W nominal output power. It is used in industrial applications for audio amplification due to its small outline package style and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,948 parts In-Stock

1+ parts

-

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1k+ parts

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2,948

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Vyrian

USA . 2,691 parts In-Stock

1+ parts

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1k+ parts

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2,691

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,779 parts In-Stock

1+ parts

$2.472

100+ parts

-

1k+ parts

$2.965

10k+ parts

-

1,779

$2.472

-

$2.965

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DigiPath Technology Company

USA . 1,838 parts In-Stock

1+ parts

$2.721

100+ parts

-

1k+ parts

-

10k+ parts

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1,838

$2.721

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ChromeModa Solutions

Germany . 5,285 parts In-Stock

1+ parts

$2.777

100+ parts

$2.277

1k+ parts

-

10k+ parts

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5,285

$2.777

$2.277

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IDEA Electronic Components Group

UK . 1,252 parts In-Stock

1+ parts

$2.777

100+ parts

-

1k+ parts

$2.499

10k+ parts

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1,252

$2.777

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$2.499

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One Stop Electronics

USA . 490 parts In-Stock

1+ parts

$6.800

100+ parts

-

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10k+ parts

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490

$6.800

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AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$9.555

100+ parts

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668

$9.555

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Corphita

USA . 3,680 parts In-Stock

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3,680

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Overview

Elevate your audio experience with the TPA711DRG4 by Texas Instruments. Crafted with precision and expertise, this audio amplifier boasts exceptional quality and reliability. Ideal for a wide range of applications in the audio and video industry, this product offers unparalleled value and benefits to customers looking for top-notch performance. Upgrade your sound system today with the TPA711DRG4 and enjoy crystal-clear audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making the product convenient for different applications.

General IC Type: AUDIO AMPLIFIER

Specifically designed as an audio amplifier, ensuring high-quality sound output for audio applications.

Nominal Output Power: 0.35 W

Provides sufficient power output for audio amplification, delivering clear and loud sound.

Nominal Bandwidth: 0.004 kHz

Wide bandwidth allows for accurate and detailed audio reproduction across all frequencies.

Technology: CMOS

CMOS technology offers low power consumption and reliable performance, making the product energy-efficient and durable.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stability and performance even in challenging environments.

Technical Specifications

Audio & Video Amplifiers TPA711DRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.004 kHz

General IC Type:

Harmonic Distortion:

.3 %

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.35 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

1.25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TPA711DRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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