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OPA359AIDBVT

Texas Instruments

OPA359AIDBVT by Texas Instruments

OPA359AIDBVT by Texas Instruments is a video amplifier with 6.02 dB gain, operating at temperatures from -40 to 125 °C. It has a small outline package style, suitable for automotive applications due to its low profile design and shrink pitch technology. With a supply voltage range of 2.7V to 3.3V, it is ideal for audio and video amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,889

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-

-

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Digiode

USA . 3,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,331

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 647 parts In-Stock

1+ parts

$1.181

100+ parts

-

1k+ parts

$1.985

10k+ parts

-

647

$1.181

-

$1.985

-

DigiPath Technology Company

USA . 1,917 parts In-Stock

1+ parts

$1.300

100+ parts

$1.196

1k+ parts

-

10k+ parts

-

1,917

$1.300

$1.196

-

-

ChromeModa Solutions

Germany . 456 parts In-Stock

1+ parts

$1.327

100+ parts

$1.088

1k+ parts

-

10k+ parts

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456

$1.327

$1.088

-

-

IDEA Electronic Components Group

UK . 342 parts In-Stock

1+ parts

$1.327

100+ parts

-

1k+ parts

$1.194

10k+ parts

-

342

$1.327

-

$1.194

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One Stop Electronics

USA . 1,111 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,111

$3.800

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-

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AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$7.304

100+ parts

-

1k+ parts

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10k+ parts

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802

$7.304

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-

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Corphita

USA . 205 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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205

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Overview

Enhance your audio and video experience with the OPA359AIDBVT by Texas Instruments. This high-quality video amplifier is designed to deliver exceptional performance and reliability, thanks to its trusted manufacturer. Perfect for a wide range of applications in the audio and video industry, this product offers customers unparalleled value, benefits, and advantages. Upgrade your systems with the OPA359AIDBVT and enjoy superior quality and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and providing a neat and compact design.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality signal processing and output.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the amplifier can function reliably even in demanding environmental conditions.

Nominal Bandwidth: 35 kHz

Wide nominal bandwidth allows for the amplification of a range of frequencies, making it versatile for different audio and video applications.

Gain: 6.02 dB

The gain value indicates the amplification capability of the device, providing a boost to the input signal for improved output quality.

Technical Specifications

Audio & Video Amplifiers OPA359AIDBVT attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

35 kHz

General IC Type:

Gain:

6.02 dB

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

OPA359AIDBVT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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