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OPA359IDBVR

Texas Instruments

OPA359IDBVR by Texas Instruments

OPA359IDBVR by Texas Instruments is a video amplifier IC with 6 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and low current consumption of 6.5mA, suitable for automotive applications due to its small outline package and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,822 parts In-Stock

1+ parts

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3,822

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Digiode

USA . 3,614 parts In-Stock

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3,614

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,746 parts In-Stock

1+ parts

$0.453

100+ parts

-

1k+ parts

$1.607

10k+ parts

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1,746

$0.453

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$1.607

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IDEA Electronic Components Group

UK . 1,781 parts In-Stock

1+ parts

$0.509

100+ parts

-

1k+ parts

$0.458

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1,781

$0.509

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$0.458

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ChromeModa Solutions

Germany . 594 parts In-Stock

1+ parts

$0.509

100+ parts

$0.417

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-

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594

$0.509

$0.417

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One Stop Electronics

USA . 645 parts In-Stock

1+ parts

$7.800

100+ parts

-

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645

$7.800

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AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$18.351

100+ parts

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224

$18.351

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Corphita

USA . 4,452 parts In-Stock

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4,452

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DigiPath Technology Company

USA . 1,014 parts In-Stock

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$0.459

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1,014

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$0.459

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Overview

Enhance your audio and video experience with the OPA359IDBVR by Texas Instruments. Crafted with precision and expertise, this video amplifier offers unparalleled quality and reliability. Ideal for automotive applications, this amplifier delivers crystal-clear sound and sharp visuals. With a sleek small outline package and low power consumption, this amplifier provides exceptional value and performance. Upgrade your audio and video systems with the OPA359IDBVR and elevate your entertainment to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making this amplifier easy to handle and resistant to damage during installation.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to work with for circuit board design and layout.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video signal processing, ensuring high-quality video output.

Power Supplies (V): 3

Low power supply requirement of 3V makes this amplifier energy efficient and suitable for a wide range of applications.

No. of Terminals: 6

Sufficient number of terminals for connecting various components and interfaces, offering flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Compact and slim design saves space on the circuit board and enables integration into compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in demanding environments or under heavy load.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme conditions without compromising performance.

Terminal Position: DUAL

Dual-terminal design provides redundancy and stability in connection, reducing the risk of signal loss or interruption.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures durability and reliability in automotive applications with fluctuating temperatures.

Terminal Form: GULL WING

Gull wing terminals offer secure and stable connection to the circuit board, enhancing overall durability and connectivity.

Maximum Supply Current: 6.5 mA

Low maximum supply current consumption conserves energy and reduces operating costs over time.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for compact layout and precise connections, facilitating high-density circuit designs.

Technical Specifications

Audio & Video Amplifiers OPA359IDBVR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G6

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6.5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

OPA359IDBVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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