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OPA359AIDBVR

Texas Instruments

OPA359AIDBVR by Texas Instruments

OPA359AIDBVR by Texas Instruments is a video amplifier with 6.02 dB gain, operating at 2.7-3.3 V and -40 to 125°C. Its small outline package makes it ideal for automotive applications requiring a compact design and low power consumption of 6.5 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,049 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,049

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-

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Digiode

USA . 1,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,831

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 601 parts In-Stock

1+ parts

$2.542

100+ parts

-

1k+ parts

$3.030

10k+ parts

-

601

$2.542

-

$3.030

-

DigiPath Technology Company

USA . 681 parts In-Stock

1+ parts

$2.799

100+ parts

$2.575

1k+ parts

-

10k+ parts

-

681

$2.799

$2.575

-

-

ChromeModa Solutions

Germany . 3,787 parts In-Stock

1+ parts

$2.856

100+ parts

$2.342

1k+ parts

-

10k+ parts

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3,787

$2.856

$2.342

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IDEA Electronic Components Group

UK . 1,581 parts In-Stock

1+ parts

$2.856

100+ parts

-

1k+ parts

$2.570

10k+ parts

-

1,581

$2.856

-

$2.570

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AZTECH Wire

Italy . 200 parts In-Stock

1+ parts

$17.295

100+ parts

-

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200

$17.295

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One Stop Electronics

USA . 1,235 parts In-Stock

1+ parts

$17.800

100+ parts

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1,235

$17.800

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Corphita

USA . 1,939 parts In-Stock

1+ parts

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1,939

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Overview

Enhance your audio and video projects with the OPA359AIDBVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this video amplifier, perfect for a wide range of applications. With a compact design and high-quality materials, this amplifier offers exceptional performance while maintaining a low profile. Experience clear, crisp sound and sharp video quality with the OPA359AIDBVR, providing value and benefits that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the amplifier, ensuring a long lifespan.

Surface Mount: YES

Surface mount technology allows for easy and compact installation, making this amplifier suitable for small electronic devices.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video signals, this amplifier ensures high-quality video output with minimal distortion.

Maximum Supply Voltage (Vsup): 3.3 V

With a high maximum supply voltage, this amplifier can handle a wide range of input signals without distortion.

Nominal Bandwidth: 35 kHz

This wide bandwidth allows the amplifier to process a wide range of frequencies, making it suitable for various audio and video applications.

Gain: 6.02 dB

The high gain of this amplifier ensures that even weak signals are amplified effectively, resulting in clear and crisp audio or video output.

Technical Specifications

Audio & Video Amplifiers OPA359AIDBVR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

35 kHz

General IC Type:

Gain:

6.02 dB

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

OPA359AIDBVR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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