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OPA360AIDCKRE4

Texas Instruments

OPA360AIDCKRE4 by Texas Instruments

OPA360AIDCKRE4 by Texas Instruments is a video amplifier IC with 6dB gain, operating at temperatures from -40 to 85°C. It has a supply voltage range of 2.7V to 3.3V and consumes a max current of 9mA. This compact, surface-mount package is ideal for audio and video amplification applications in industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 124,830 parts In-Stock

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Vyrian

USA . 6,884 parts In-Stock

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Digiode

USA . 4,100 parts In-Stock

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4,100

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Parana Technologies

USA . 1,250 parts In-Stock

1+ parts

$2.189

100+ parts

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$2.699

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$2.189

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$2.699

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DigiPath Technology Company

USA . 222 parts In-Stock

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$2.411

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$2.218

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222

$2.411

$2.218

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ChromeModa Solutions

Germany . 1,034 parts In-Stock

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$2.460

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$2.017

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1,034

$2.460

$2.017

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IDEA Electronic Components Group

UK . 46 parts In-Stock

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$2.460

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$2.214

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46

$2.460

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One Stop Electronics

USA . 1,100 parts In-Stock

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$15.800

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$15.800

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AZTECH Wire

Italy . 601 parts In-Stock

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$16.840

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601

$16.840

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iodParts Technologies Inc.

India . 2,873 parts In-Stock

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2,873

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Corphita

USA . 2,405 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,592 parts In-Stock

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Overview

Elevate your audio and video experience with the OPA360AIDCKRE4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. As part of the Audio & Video Amplifiers category, this video amplifier offers exceptional performance and reliability, making it ideal for a wide range of applications. With its compact design and advanced features, this product provides customers with unmatched value, benefits, and advantages. Upgrade your audio and video systems today with the OPA360AIDCKRE4 and take your entertainment to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio and video amplifier applications.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the circuit board, making the product suitable for compact electronic devices.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video amplification, ensuring high-quality video output for a variety of applications such as monitors, TVs, and projectors.

Power Supplies (V): 3

Operates at a standard voltage of 3V, making it compatible with a wide range of power sources and ensuring stable performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand extended use without overheating, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for use in colder climates or industrial applications where temperature fluctuations may occur.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection for optimal signal transmission.

Width: 1.25 mm

The compact width of the product allows for tight spacing on the circuit board, making it suitable for designs where space is limited.

Gain: 6 dB

With a gain of 6 dB, the product can amplify video signals effectively, improving the overall quality of the output signal for enhanced viewing experience.

Maximum Supply Voltage (Vsup): 3.3 V

Operating at a maximum supply voltage of 3.3V ensures compatibility with standard power sources and provides a stable power supply for optimal performance.

Technical Specifications

Audio & Video Amplifiers OPA360AIDCKRE4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

Gain:

6 dB

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

OPA360AIDCKRE4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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