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NCP2809BDMR2G

Onsemi

NCP2809BDMR2G by Onsemi

NCP2809BDMR2G by Onsemi is an audio amplifier IC with 2 channels, operating voltage of 2.5-5V, and power output of 0.131W. It comes in a small outline package suitable for industrial applications requiring compact design and low power consumption. The IC has a temperature range of -40 to 85°C making it ideal for various audio and video amplification needs.

Median Price

$0.340

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 590,368 parts In-Stock

1+ parts

-

100+ parts

$0.443

1k+ parts

$0.322

10k+ parts

$0.273

590,368

-

$0.443

$0.322

$0.273

Rochester

USA . 560,368 parts In-Stock

1+ parts

-

100+ parts

$0.340

1k+ parts

$0.282

10k+ parts

$0.251

560,368

-

$0.340

$0.282

$0.251

Verical

USA . 324,916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.382

10k+ parts

$0.314

324,916

-

-

$0.382

$0.314

DigiKey

USA . 7,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.190

7,511

-

-

-

$0.190

Flip Electronics (Authorized)

USA . 7,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,511

-

-

-

-

Mouser Electronics

USA . 1,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.252

1,456

-

-

-

$0.252

Chip1Stop

Japan . 4 parts In-Stock

1+ parts

-

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-

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-

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4

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,314 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

-

10k+ parts

-

1,314

$0.277

-

-

-

Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$0.304

100+ parts

-

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-

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-

35

$0.304

-

-

-

Vyrian

USA . 243,968 parts In-Stock

1+ parts

-

100+ parts

-

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243,968

-

-

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Chip Stock

USA . 39,000 parts In-Stock

1+ parts

-

100+ parts

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39,000

-

-

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Flip Electronics

USA . 7,511 parts In-Stock

1+ parts

-

100+ parts

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7,511

-

-

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Cyclops Electronics Ltd

UK . 482 parts In-Stock

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482

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 245,714 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

-

10k+ parts

-

245,714

$0.214

-

-

-

Semicontronic

India . 245,679 parts In-Stock

1+ parts

$0.214

100+ parts

$0.209

1k+ parts

$0.208

10k+ parts

-

245,679

$0.214

$0.209

$0.208

-

Corohmni

South Africa . 395 parts In-Stock

1+ parts

$0.252

100+ parts

-

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-

10k+ parts

-

395

$0.252

-

-

-

Corphita

USA . 1,694 parts In-Stock

1+ parts

$0.263

100+ parts

-

1k+ parts

-

10k+ parts

-

1,694

$0.263

-

-

-

Component Stockers USA

USA . 474,225 parts In-Stock

1+ parts

$0.300

100+ parts

$0.280

1k+ parts

$0.260

10k+ parts

$0.260

474,225

$0.300

$0.280

$0.260

$0.260

Argo Parts USA

USA . 3,309 parts In-Stock

1+ parts

$0.304

100+ parts

-

1k+ parts

-

10k+ parts

$0.295

3,309

$0.304

-

-

$0.295

Continental Prestige Electronics

USA . 597,427 parts In-Stock

1+ parts

$0.542

100+ parts

$0.346

1k+ parts

$0.213

10k+ parts

$0.210

597,427

$0.542

$0.346

$0.213

$0.210

Vigor

Singapore . 600 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$0.800

-

-

-

Benley Electronics

USA . 6 parts In-Stock

1+ parts

$0.800

100+ parts

-

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-

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-

6

$0.800

-

-

-

Microchip USA

USA . 242 parts In-Stock

1+ parts

$1.890

100+ parts

$1.870

1k+ parts

$1.870

10k+ parts

$1.860

242

$1.890

$1.870

$1.870

$1.860

Aztec Data Supply Inc.

USA . 2,133 parts In-Stock

1+ parts

$2.727

100+ parts

-

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-

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2,133

$2.727

-

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Kepictronics

USA . 8,423 parts In-Stock

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8,423

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

-

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Perfect Parts

USA . 6,698 parts In-Stock

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6,698

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Problanco Electronics

Mexico . 5,852 parts In-Stock

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5,852

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SupplyDigital Components

Austria . 5,272 parts In-Stock

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5,272

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Lixinc

USA . 5,020 parts In-Stock

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5,020

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Kulean Microsystems

USA . 3,774 parts In-Stock

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3,774

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Assy Fe

Spain . 3,550 parts In-Stock

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3,550

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TANS Electronics

Latvia . 2,541 parts In-Stock

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2,541

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A-Z Elektronik GmbH

Germany . 1,814 parts In-Stock

1+ parts

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1,814

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Futuretech Components

Singapore . 695 parts In-Stock

1+ parts

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695

-

-

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UHIMA Technologies

Türkiye . 176 parts In-Stock

1+ parts

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176

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-

Overview

Enhance your audio experience with the NCP2809BDMR2G by Onsemi, a top-quality audio amplifier that delivers crystal-clear sound in a compact package. Manufactured by Onsemi, a trusted industry leader, this amplifier is perfect for a wide range of audio and video applications. With a sleek design and reliable performance, this product offers exceptional value to customers looking to upgrade their audio systems. Say goodbye to low-quality sound and hello to a new level of audio excellence with the NCP2809BDMR2G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the amplifier components, ensuring a longer lifespan of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape allows for a compact design, making it suitable for various electronic devices with limited space.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output for audio devices.

Power Supplies (V): 2.5/5

Can handle a range of power supplies, making it versatile for different voltage requirements.

No. of Terminals: 10

Sufficient terminals for connecting to various components and interfaces, enhancing flexibility in usage.

Maximum Operating Temperature: 85 °C

Can operate efficiently in higher temperature environments, ideal for devices that generate heat during operation.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature conditions, making it suitable for a wide range of operating environments.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a reliable and corrosion-resistant finish for the terminals, ensuring stable connections over time.

Nominal Output Power: 0.131 W

Offers sufficient power output for audio amplification, delivering clear and strong sound output.

Maximum Seated Height: 1.1 mm

Low profile design allows for easy integration into compact electronic devices.

Width: 3 mm

Compact width enables the amplifier to fit into tight spaces within electronic devices.

Minimum Supply Voltage (Vsup): 2.2 V

Works efficiently even with low supply voltage, ensuring compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

High temperature tolerance makes it suitable for reflow soldering processes without compromising performance.

Length: 3 mm

Compact length allows for space-saving integration into electronic devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature environments, ensuring durability and stability.

No. of Channels: 2

Dual channels provide stereo audio output, enhancing the audio experience for users.

Terminal Form: GULL WING

Gull wing terminals offer secure soldering points for stable connections in electronic circuits.

Maximum Supply Current: 3.6 mA

Low supply current consumption for energy-efficient operation.

Terminal Pitch: 0.5 mm

Narrow terminal pitch enables dense packaging and space-efficient design on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

Handles higher supply voltage for increased power output capability, suitable for a wide range of applications.

Technical Specifications

Audio & Video Amplifiers NCP2809BDMR2G attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.131 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3.6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

NCP2809BDMR2G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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