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NCP2809ADMR2

Onsemi

NCP2809ADMR2 by Onsemi

NCP2809ADMR2 by Onsemi is an audio amplifier IC with 2 channels, operating voltage of 2.5-5V, and power output of 0.131W. It comes in a small outline package suitable for industrial applications requiring low power consumption and compact design. The IC features dual terminals, Gull Wing form, and operates within -40 to 85 °C temperature range.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 6,377 parts In-Stock

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Digiode

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Zilex Electronics Inc.

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AZTECH Wire

Italy . 574 parts In-Stock

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$11.820

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Component Stockers USA

USA . 647 parts In-Stock

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$99.990

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RC Electronics

USA . 9,000 parts In-Stock

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Problanco Electronics

Mexico . 6,370 parts In-Stock

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TANS Electronics

Latvia . 3,463 parts In-Stock

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Corphita

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Kepictronics

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Vigor

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Kulean Microsystems

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Perfect Parts

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UHIMA Technologies

Türkiye . 403 parts In-Stock

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Microchip USA

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SupplyDigital Components

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Overview

Enhance your audio and video experiences with the NCP2809ADMR2 by Onsemi. Crafted with precision and quality, this audio amplifier is designed to deliver exceptional sound performance in a compact package. Perfect for a wide range of applications, this amplifier offers customers unmatched value and benefits. Elevate your listening experience with the NCP2809ADMR2 and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the internal components of the amplifier.

Power Supplies (V): 2.5/5

The amplifier can be powered by a range of voltage supplies, providing flexibility in different operating environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this amplifier can withstand prolonged use without overheating.

Nominal Output Power: 0.131 W

The amplifier provides a decent output power for audio signals, suitable for various applications.

No. of Channels: 2

Having 2 channels allows for stereo sound output, enhancing the audio experience for the user.

Technical Specifications

Audio & Video Amplifiers NCP2809ADMR2 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

Gain:

0 dB

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.131 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3.6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

NCP2809ADMR2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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