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OPA693IDBVRG4

Texas Instruments

OPA693IDBVRG4 by Texas Instruments

OPA693IDBVRG4 by Texas Instruments is a video amplifier IC with 6 terminals, operating temperature range of -40 to 85°C. It has a small outline package style and can operate on supply voltages from 2.5V to 6V. Ideal for audio/video applications requiring high-quality signal amplification in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,082 parts In-Stock

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4,082

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Digiode

USA . 1,700 parts In-Stock

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1,700

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Parana Technologies

USA . 383 parts In-Stock

1+ parts

$2.465

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$2.958

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383

$2.465

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$2.958

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DigiPath Technology Company

USA . 2,364 parts In-Stock

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$2.715

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$2.497

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2,364

$2.715

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

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$2.770

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$2.493

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2,077

$2.770

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ChromeModa Solutions

Germany . 932 parts In-Stock

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$2.770

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$2.271

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932

$2.770

$2.271

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AZTECH Wire

Italy . 689 parts In-Stock

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$7.434

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689

$7.434

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Ampacity Inc.

Singapore . 1,009 parts In-Stock

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$12.800

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$12.800

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One Stop Electronics

USA . 625 parts In-Stock

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$21.800

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625

$21.800

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Continental Prestige Electronics

USA . 6,747 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,518 parts In-Stock

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Argo Parts USA

USA . 3,117 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Corphita

USA . 2,907 parts In-Stock

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Perfect Parts

USA . 896 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Elevate your audio and video experience with the OPA693IDBVRG4 by Texas Instruments. Crafted with precision and expertise, this video amplifier offers unparalleled quality and performance. Designed for a wide range of applications, this small outline, low profile package delivers crystal-clear sound and visuals with ease. Whether you're enhancing your home entertainment system or upgrading professional video equipment, this Texas Instruments product provides exceptional value and reliability. Take your audio and video to the next level with the OPA693IDBVRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the amplifier.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation of the amplifier on circuit boards, saving space and reducing assembly time.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this amplifier can withstand a wide range of environmental conditions, ensuring reliable performance in various applications.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement of 2.5 V makes this amplifier suitable for use in low-power applications, helping to conserve energy.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating indicates that this amplifier is designed to operate in harsh industrial environments, making it a robust and reliable choice for industrial applications.

Technical Specifications

Audio & Video Amplifiers OPA693IDBVRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 5V TO 12V SINGLE SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

OPA693IDBVRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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