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OPA658N

Texas Instruments

OPA658N by Texas Instruments

OPA658N by Texas Instruments is a video amplifier IC with 5 terminals in a small outline package. It features a low profile design with gull wing terminals and is suitable for industrial temperature grade applications. The package body material is plastic/epoxy, making it ideal for surface mount installations in audio and video amplifiers.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,509 parts In-Stock

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4,509

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Digiode

USA . 731 parts In-Stock

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731

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Prism Electronics

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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Parana Technologies

USA . 2,003 parts In-Stock

1+ parts

$3.406

100+ parts

$316.302

1k+ parts

$3.065

10k+ parts

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2,003

$3.406

$316.302

$3.065

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DigiPath Technology Company

USA . 761 parts In-Stock

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$3.750

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761

$3.750

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ChromeModa Solutions

Germany . 4,143 parts In-Stock

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$3.827

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$3.138

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4,143

$3.827

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IDEA Electronic Components Group

UK . 357 parts In-Stock

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$3.827

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$3.444

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357

$3.827

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$3.444

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One Stop Electronics

USA . 2,448 parts In-Stock

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$9.800

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$9.800

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AZTECH Wire

Italy . 386 parts In-Stock

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$17.444

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386

$17.444

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A-Z Elektronik GmbH

Germany . 11,271 parts In-Stock

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Lixinc

USA . 10,532 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 2,240 parts In-Stock

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Kepictronics

USA . 1,890 parts In-Stock

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1,890

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Overview

Elevate your audio and video experience with the OPA658N by Texas Instruments. Crafted with precision and expertise, this video amplifier offers unparalleled quality and reliability. Whether you're a sound enthusiast or a tech-savvy consumer, the OPA658N delivers exceptional performance and clarity in every application. Trust in Texas Instruments to provide cutting-edge technology that enhances your entertainment experience. Upgrade your audio and video set-up today with the OPA658N and discover the true value of superior amplification.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor for easy integration into various devices.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video amplification, ensuring high-quality video output.

No. of Terminals: 5

Sufficient number of terminals for connecting various components and peripherals.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile design enables easy installation in tight spaces.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit connectivity.

Maximum Seated Height: 1.45 mm

Low seated height allows for a slim and sleek design.

Width: 1.625 mm

Narrow width for space-saving installation.

Length: 2.95 mm

Compact length for efficient use of space.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature requirements for reliable performance in harsh conditions.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for high-density mounting and fine-tuning of connections.

Technical Specifications

Audio & Video Amplifiers OPA658N attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G5

Length:

2.95 mm

No. of Functions:

1

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

OPA658N General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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