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TPA2001D1PWRG4

Texas Instruments

TPA2001D1PWRG4 by Texas Instruments

TPA2001D1PWRG4 by Texas Instruments is an audio amplifier with 1W output power, 23.5dB gain, and 1% harmonic distortion. It operates at -40 to 85°C, requires 2.5-5.5V supply voltage, and has a small outline package suitable for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 5,510 parts In-Stock

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Digiode

USA . 4,254 parts In-Stock

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Vyrian

USA . 4,086 parts In-Stock

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Martec Srl

Italy . 808 parts In-Stock

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808

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Corohmni

South Africa . 547 parts In-Stock

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$2.353

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547

$2.353

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Parana Technologies

USA . 69 parts In-Stock

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$3.542

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$4.066

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69

$3.542

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DigiPath Technology Company

USA . 918 parts In-Stock

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$3.900

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$3.588

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918

$3.900

$3.588

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ChromeModa Solutions

Germany . 1,564 parts In-Stock

1+ parts

$3.980

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$3.264

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1,564

$3.980

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IDEA Electronic Components Group

UK . 1,493 parts In-Stock

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$3.980

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$3.582

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AZTECH Wire

Italy . 438 parts In-Stock

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$5.361

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Ampacity Inc.

Singapore . 641 parts In-Stock

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$7.800

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$7.800

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One Stop Electronics

USA . 737 parts In-Stock

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$14.800

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$14.800

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Semicontronic

India . 1,136 parts In-Stock

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$16.800

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$16.380

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$16.296

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QUARKTWIN TECHNOLOGY LTD

USA . 19,231 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Microchip USA

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Corphita

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Perfect Parts

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Continental Prestige Electronics

USA . 809 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Advanced Electronics

New Zealand . 59 parts In-Stock

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Overview

Elevate your audio experience with the TPA2001D1PWRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This audio amplifier is versatile and perfect for a wide range of applications in the audio and video field. With its compact design and low power consumption, this product offers exceptional value to customers looking for high-performance audio solutions. Upgrade your audio system today with the TPA2001D1PWRG4 and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and light weight, making the amplifier easy to handle and transport.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

This shape maximizes space efficiency on the circuit board, allowing for more components to be placed close together.

General IC Type: AUDIO AMPLIFIER

Specifically designed for amplifying audio signals, ensuring high-quality sound output.

Harmonic Distortion: 1%

Low distortion ensures clear and crisp sound reproduction without any unwanted noise.

Power Supplies (V): 3.3/5

Compatible with common power supplies, making it easy to integrate into existing systems.

No. of Terminals: 16

Provides ample connection options for various input and output configurations.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design saves space on the circuit board, ideal for applications with limited space.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for use in a variety of environments.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, ensuring reliability in different climate conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures reliable electrical connections for long-term performance.

Nominal Output Power: 1 W

Sufficient power output for driving speakers and headphones with clear audio output.

Maximum Seated Height: 1.2 mm

Low profile design for compact installations where space is limited.

Width: 4.4 mm

Narrow width allows for easy integration into tight spaces on the circuit board.

Minimum Supply Voltage (Vsup): 2.5 V

Can operate with low voltage input, making it suitable for portable and battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly without damaging the amplifier.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder joints and long-term durability.

Nominal Noise Figure: 95 dB

Low noise figure ensures clear audio signal reproduction with minimal interference.

Length: 5 mm

Compact length for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability in demanding conditions.

Technology: CMOS

CMOS technology provides low power consumption and efficient operation for extended battery life in portable devices.

Nominal Bandwidth: 0.02 kHz

Wide bandwidth for accurate audio signal reproduction across the frequency spectrum.

Terminal Form: GULL WING

Gull wing terminals for easy handling and reliable solder connections during assembly.

Maximum Supply Current: 6 mA

Low current consumption for energy-efficient operation and extended battery life.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for compact layout design and efficient use of circuit board space.

Gain: 23.5 dB

High gain for amplifying audio signals without distortion, providing clear and loud sound output.

Maximum Supply Voltage (Vsup): 5.5 V

High supply voltage compatibility for versatile applications with different power sources.

Technical Specifications

Audio & Video Amplifiers TPA2001D1PWRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

23.5 dB

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Nominal Noise Figure:

95 dB

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA2001D1PWRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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