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OPA692IDRG4

Texas Instruments

OPA692IDRG4 by Texas Instruments

OPA692IDRG4 by Texas Instruments is a video amplifier IC with 8 terminals, operating temperature range of -40 to 85°C, and supply voltage range of 2.5V to 6V. It is designed for audio & video applications requiring small outline package style and industrial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,711 parts In-Stock

1+ parts

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6,711

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Digiode

USA . 3,072 parts In-Stock

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3,072

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,109 parts In-Stock

1+ parts

$2.243

100+ parts

$208.278

1k+ parts

$2.019

10k+ parts

-

1,109

$2.243

$208.278

$2.019

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DigiPath Technology Company

USA . 1,977 parts In-Stock

1+ parts

$2.470

100+ parts

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1,977

$2.470

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ChromeModa Solutions

Germany . 6,651 parts In-Stock

1+ parts

$2.520

100+ parts

$2.066

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6,651

$2.520

$2.066

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IDEA Electronic Components Group

UK . 168 parts In-Stock

1+ parts

$2.520

100+ parts

-

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$2.268

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168

$2.520

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$2.268

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One Stop Electronics

USA . 372 parts In-Stock

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$16.800

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372

$16.800

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AZTECH Wire

Italy . 280 parts In-Stock

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$19.709

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280

$19.709

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Component Stockers USA

USA . 259 parts In-Stock

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$99.990

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259

$99.990

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Corphita

USA . 4,786 parts In-Stock

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4,786

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 896 parts In-Stock

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Kepictronics

USA . 270 parts In-Stock

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270

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Overview

Enhance your audio and video experience with the OPA692IDRG4 by Texas Instruments. Known for its superior quality and reliability, Texas Instruments delivers exceptional performance in the Audio & Video Amplifiers category. This versatile product is perfect for a wide range of applications, providing customers with unmatched value and benefits. Upgrade your sound and visuals today with the OPA692IDRG4 and experience the difference TI technology can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring the amplifier is easy to handle and can withstand daily use.

Surface Mount: YES

Being surface mountable allows for easy installation on a circuit board, saving space and making the amplifier suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor, making it compatible with various mounting configurations and easy to integrate into different systems.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video applications, this amplifier ensures high-quality video signals with minimal distortion, making it an ideal choice for audio and video systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functionalities, giving flexibility in circuit design and enabling various input and output options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices where size is a constraint.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments, making it suitable for industrial applications where temperature variations occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the amplifier to function in cold conditions without any performance degradation, making it versatile for use in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on terminals provides excellent conductivity and corrosion resistance, ensuring stable electrical connections and long-term reliability.

Terminal Position: DUAL

Having dual terminal positions adds flexibility in mounting and connectivity options, allowing for different configurations and ease of installation.

Maximum Seated Height: 1.75 mm

The low maximum seated height contributes to a compact form factor, making the amplifier suitable for thin and space-constrained electronic devices.

Width: 3.9 mm

The narrow width of the amplifier saves space and allows for compact PCB designs, making it ideal for applications where size is a critical factor.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement enables the amplifier to operate efficiently with low-power sources, making it energy-efficient and suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the amplifier can undergo reflow soldering process without damage, ensuring reliable solder joints and ease of assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the amplifier suitable for lead-free soldering processes, ensuring compliance with industry standards and regulations.

Length: 4.9 mm

The compact length of the amplifier contributes to a space-saving design, making it suitable for small electronic devices and applications where size constraints exist.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making the amplifier a rugged and durable choice for industrial applications.

Technology: BIPOLAR

The bipolar technology used in the amplifier offers high performance and precision in amplifying video signals, ensuring excellent signal fidelity and clarity in audio and video applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and enhances mechanical strength, ensuring secure connections and ease of installation on the PCB.

Maximum Supply Current: 5.8 mA

The low maximum supply current requirement contributes to energy efficiency and helps in reducing power consumption, making the amplifier suitable for low-power applications.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for dense packing on the PCB, enabling compact and space-efficient circuit designs, especially in applications where space is limited.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates the level of moisture sensitivity during the soldering process, ensuring proper handling and storage to maintain the integrity of the amplifier.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6 V provides operational flexibility and compatibility with a wide range of power sources, making the amplifier versatile for various applications.

Technical Specifications

Audio & Video Amplifiers OPA692IDRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 5V TO 12V SINGLE SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

5.8 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

OPA692IDRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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