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OPA692IDG4

Texas Instruments

OPA692IDG4 by Texas Instruments

OPA692IDG4 by Texas Instruments is a video amplifier IC with 8 terminals, operating temperature range of -40 to 85°C, and supply voltage from 2.5V to 6V. It is designed for audio & video applications requiring small outline packaging and industrial-grade performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,978 parts In-Stock

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4,978

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Digiode

USA . 418 parts In-Stock

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418

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,299 parts In-Stock

1+ parts

$1.904

100+ parts

-

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$2.441

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2,299

$1.904

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$2.441

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DigiPath Technology Company

USA . 851 parts In-Stock

1+ parts

$2.096

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851

$2.096

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IDEA Electronic Components Group

UK . 2,105 parts In-Stock

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$2.139

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-

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$1.925

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2,105

$2.139

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$1.925

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ChromeModa Solutions

Germany . 342 parts In-Stock

1+ parts

$2.139

100+ parts

$1.754

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342

$2.139

$1.754

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One Stop Electronics

USA . 1,556 parts In-Stock

1+ parts

$11.800

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1,556

$11.800

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AZTECH Wire

Italy . 308 parts In-Stock

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$17.692

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308

$17.692

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Corphita

USA . 4,558 parts In-Stock

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Perfect Parts

USA . 728 parts In-Stock

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728

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Overview

Unlock the power of high-quality audio and video amplification with the OPA692IDG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that guarantee superior performance and reliability. This versatile video amplifier is perfect for a wide range of applications, providing crystal-clear sound and sharp visuals. Experience exceptional value with the OPA692IDG4, offering customers unparalleled benefits and advantages in their audio and video projects. Elevate your next project with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the amplifier.

Surface Mount: YES

Allows for easy and secure placement on circuit boards, saving space and making installation more efficient.

Maximum Operating Temperature: 85 °C

Ensures that the amplifier can operate effectively even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Allows for a wide range of operating temperatures, making the amplifier suitable for various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent conductivity and corrosion resistance for reliable performance.

Width: 3.9 mm

Compact size enables easy integration into different audio and video systems.

Minimum Supply Voltage (Vsup): 2.5 V

Works efficiently with low power supply voltages, saving energy and improving overall efficiency.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring long-term reliability.

Technology: BIPOLAR

Utilizes bipolar technology for high-speed performance and accurate signal amplification.

Maximum Supply Voltage (Vsup): 6 V

Supports a wide range of supply voltages, making the amplifier versatile and compatible with different systems.

Technical Specifications

Audio & Video Amplifiers OPA692IDG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 5V TO 12V SINGLE SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

OPA692IDG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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