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THS3062DGNR

Texas Instruments

THS3062DGNR by Texas Instruments

THS3062DGNR by Texas Instruments is a video preamplifier with 8 terminals, operating temperature range of -40 to 85°C. It has a nominal bandwidth of 300 kHz and supports supply voltage from 5V to 15V. Ideal for audio/video amplification applications requiring high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,883 parts In-Stock

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Vyrian

USA . 2,322 parts In-Stock

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Nova Conductors

Japan . 44 parts In-Stock

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Corohmni

South Africa . 37 parts In-Stock

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$2.446

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37

$2.446

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Parana Technologies

USA . 1,706 parts In-Stock

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$2.955

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$3.456

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1,706

$2.955

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$3.456

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ChromeModa Solutions

Germany . 4,511 parts In-Stock

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$3.320

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$2.722

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$3.320

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IDEA Electronic Components Group

UK . 726 parts In-Stock

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$3.320

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$2.988

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726

$3.320

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$2.988

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One Stop Electronics

USA . 1,365 parts In-Stock

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$6.800

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$6.800

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AZTECH Wire

Italy . 322 parts In-Stock

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$17.991

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$17.991

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Ampacity Inc.

Singapore . 1,534 parts In-Stock

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$19.800

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QUARKTWIN TECHNOLOGY LTD

USA . 9,513 parts In-Stock

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Argo Parts USA

USA . 4,027 parts In-Stock

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Continental Prestige Electronics

USA . 3,297 parts In-Stock

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Corphita

USA . 919 parts In-Stock

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Microchip USA

USA . 377 parts In-Stock

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377

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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DigiPath Technology Company

USA . 227 parts In-Stock

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$2.993

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227

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$2.993

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Overview

Elevate your audio and video experience with the THS3062DGNR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. The THS3062DGNR falls under the category of Audio & Video Amplifiers, offering superior performance and precision for a wide range of applications. With its advanced technology and industrial-grade design, this video preamplifier ensures optimal functionality and efficiency. Trust Texas Instruments to provide you with top-notch solutions that elevate your projects to the next level. Choose the THS3062DGNR for unmatched value, benefits, and advantages that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the amplifier.

Surface Mount: YES

Surface mount technology allows for easy and quick installation of the amplifier on various circuit boards, making it suitable for mass production.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on the circuit board, making it ideal for compact electronic devices.

General IC Type: VIDEO PREAMPLIFIER

Being a video preamplifier, this product is specifically designed to amplify video signals, ensuring high-quality output for video applications.

No. of Terminals: 8

The 8 terminals provide multiple connection points, allowing for flexible integration with other electronic components in the system.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this amplifier can withstand high temperature environments, ensuring reliable performance under tough conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this amplifier suitable for a wide range of operating environments, including extreme cold conditions.

Width: 3 mm

The compact width of 3mm makes this amplifier suitable for applications where space is limited, such as in portable electronic devices.

Minimum Supply Voltage (Vsup): 5 V

The low minimum supply voltage requirement of 5V makes this amplifier energy-efficient and compatible with a wide range of power sources.

Nominal Bandwidth: 300 kHz

With a nominal bandwidth of 300 kHz, this amplifier is capable of handling high-frequency video signals, ensuring superior signal fidelity and clarity.

Technical Specifications

Audio & Video Amplifiers THS3062DGNR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 10V TO 30V SINGLE SUPPLY

Nominal Bandwidth:

300 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

THS3062DGNR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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