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THS3001CDGNRG4

Texas Instruments

THS3001CDGNRG4 by Texas Instruments

THS3001CDGNRG4 by Texas Instruments is a video amplifier IC with 8 terminals, operating temperature range of 0-70°C, and nominal bandwidth of 420 kHz. It is used in audio/video applications requiring a supply voltage b/w 4.5V to 16.5V, making it suitable for various commercial-grade electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,873 parts In-Stock

1+ parts

-

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-

1k+ parts

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5,873

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Digiode

USA . 1,870 parts In-Stock

1+ parts

-

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-

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1,870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 302 parts In-Stock

1+ parts

$2.132

100+ parts

$197.947

1k+ parts

$1.918

10k+ parts

-

302

$2.132

$197.947

$1.918

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DigiPath Technology Company

USA . 1,503 parts In-Stock

1+ parts

$2.347

100+ parts

$2.159

1k+ parts

-

10k+ parts

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1,503

$2.347

$2.159

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IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$2.395

100+ parts

-

1k+ parts

$2.156

10k+ parts

-

2,302

$2.395

-

$2.156

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ChromeModa Solutions

Germany . 2,112 parts In-Stock

1+ parts

$2.395

100+ parts

$1.964

1k+ parts

-

10k+ parts

-

2,112

$2.395

$1.964

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AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$13.550

100+ parts

-

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587

$13.550

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One Stop Electronics

USA . 979 parts In-Stock

1+ parts

$16.800

100+ parts

-

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979

$16.800

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Corphita

USA . 241 parts In-Stock

1+ parts

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241

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Overview

Enhance your audio and video experience with the Texas Instruments THS3001CDGNRG4 Video Amplifier. Manufactured with top-quality materials and cutting-edge technology, this small outline package offers customers a reliable and high-performance solution for their amplifier needs. Whether you're looking to improve the clarity of your home entertainment system or enhance the quality of your professional audio equipment, the THS3001CDGNRG4 delivers exceptional value, benefits, and advantages that will exceed your expectations. Elevate your sound and visuals with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the product, making it a good choice for long-term use.

Surface Mount: YES

With surface mount capability, this amplifier is easy to install and can be placed on a variety of surfaces, making it convenient for various applications.

General IC Type: VIDEO AMPLIFIER

Being a video amplifier, this product is specifically designed to enhance video signals, ensuring optimal performance and high-quality video output.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this amplifier can withstand extended use without overheating, ensuring stable performance.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement allows for flexibility in power sources, making this amplifier suitable for a wide range of applications.

Technology: BIPOLAR

Utilizing bipolar technology ensures high-speed performance and low noise, making this amplifier an excellent choice for applications requiring precise signal amplification.

Nominal Bandwidth: 420 kHz

With a wide nominal bandwidth of 420 kHz, this amplifier can accurately amplify a broad range of video signals, resulting in sharp and clear output.

Technical Specifications

Audio & Video Amplifiers THS3001CDGNRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

420 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

THS3001CDGNRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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