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THS3001HVIDGNRG4

Texas Instruments

THS3001HVIDGNRG4 by Texas Instruments

THS3001HVIDGNRG4 by Texas Instruments is a video amplifier with 8 terminals and a bandwidth of 420 kHz. It operates b/w -40 to 85°C, suitable for industrial use. This small outline package with gull wing terminals is ideal for audio and video amplification applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,856 parts In-Stock

1+ parts

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3,856

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Digiode

USA . 3,782 parts In-Stock

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3,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 768 parts In-Stock

1+ parts

$2.735

100+ parts

$253.983

1k+ parts

$2.461

10k+ parts

-

768

$2.735

$253.983

$2.461

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DigiPath Technology Company

USA . 1,012 parts In-Stock

1+ parts

$3.012

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1,012

$3.012

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IDEA Electronic Components Group

UK . 2,184 parts In-Stock

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$3.073

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$2.766

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2,184

$3.073

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$2.766

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ChromeModa Solutions

Germany . 1,104 parts In-Stock

1+ parts

$3.073

100+ parts

$2.520

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1,104

$3.073

$2.520

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AZTECH Wire

Italy . 793 parts In-Stock

1+ parts

$11.697

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793

$11.697

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One Stop Electronics

USA . 395 parts In-Stock

1+ parts

$17.800

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395

$17.800

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Component Stockers USA

USA . 400 parts In-Stock

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$99.990

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400

$99.990

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Corphita

USA . 1,027 parts In-Stock

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Microchip USA

USA . 183 parts In-Stock

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Overview

Experience unparalleled audio and video amplification with the THS3001HVIDGNRG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance and reliability. This video amplifier is perfect for a wide range of applications, providing clear and crisp sound and image quality. With its compact design and industrial-grade technology, this product offers customers unbeatable value and versatility. Upgrade your audio and video systems today with the THS3001HVIDGNRG4 and enjoy a superior viewing and listening experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and resistance to physical damage, making the product suitable for rugged environments.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into various electronic devices without the need for additional hardware, saving space and simplifying the design.

General IC Type: VIDEO AMPLIFIER

The video amplifier type ensures high-quality signal amplification for video applications, providing clear and crisp visuals without distortion.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the amplifier can perform reliably even in demanding thermal conditions, increasing its versatility and usability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the amplifier to function effectively in cold environments, making it suitable for a wide range of applications.

Technology: BIPOLAR

The use of bipolar technology in the amplifier ensures high-speed performance and accurate signal amplification, delivering superior audio and video quality.

Technical Specifications

Audio & Video Amplifiers THS3001HVIDGNRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

420 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

18.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

THS3001HVIDGNRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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