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TDA8950J

NXP Semiconductors

TDA8950J by NXP Semiconductors

NXP Semiconductors' TDA8950J is a 2-channel audio amplifier with 170W output power. It features low harmonic distortion of 0.05% and operates b/w -40 to 85°C. Ideal for industrial applications requiring high-quality audio amplification in a compact rectangular package.

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Nova Conductors

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ACDS - Activité Composants Distribution Service

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Aztec Data Supply Inc.

USA . 2,603 parts In-Stock

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Corohmni

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Ampacity Inc.

Singapore . 1,256 parts In-Stock

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AZTECH Wire

Italy . 259 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Overview

NXP Semiconductors presents the TDA8950J audio amplifier, a top-of-the-line product that delivers high-quality sound and exceptional performance. Ideal for a wide range of applications, this amplifier is designed to enhance your audio experience with its 170W nominal output power and minimal harmonic distortion of just 0.05%. With NXP's reputation for reliability and innovation, you can trust that the TDA8950J will exceed your expectations. Upgrade your audio system today and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to impact, making the product robust for long-term use.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output for audio applications.

Nominal Output Power: 170 W

High output power capacity allows for loud and clear audio output, suitable for various audio setups.

No. of Channels: 2

Dual-channel setup allows for stereo sound reproduction and greater audio separation for immersive listening experience.

Harmonic Distortion: 0.05 %

Low harmonic distortion ensures clean and accurate sound reproduction without unwanted noise or interference.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Technical Specifications

Audio & Video Amplifiers TDA8950J attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

.05 %

JESD-30 Code:

R-PZFM-T23

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

23

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

170 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP23,.2,.17

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

+-35

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

12.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8950J General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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