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NCP2815BFCT1G

Onsemi

NCP2815BFCT1G by Onsemi

NCP2815BFCT1G by Onsemi is a 2-function audio amplifier with power supplies of 1.8/3.3V, operating temperature range of -40 to 85 °C. It comes in a rectangular package style with 12 terminals and is suitable for industrial applications requiring audio amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,148 parts In-Stock

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2,148

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Vyrian

USA . 538 parts In-Stock

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538

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Distributors (Availability)

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TANS Electronics

Latvia . 6,006 parts In-Stock

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6,006

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Kulean Microsystems

USA . 5,713 parts In-Stock

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5,713

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SupplyDigital Components

Austria . 5,686 parts In-Stock

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5,686

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Problanco Electronics

Mexico . 2,648 parts In-Stock

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2,648

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Corphita

USA . 1,742 parts In-Stock

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1,742

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UHIMA Technologies

Türkiye . 649 parts In-Stock

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649

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Corohmni

South Africa . 327 parts In-Stock

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Overview

Enhance your audio and video experience with the NCP2815BFCT1G by Onsemi. This high-quality audio amplifier offers superior performance and reliability, setting it apart from other products in its category. Whether you're looking to upgrade your home entertainment system or enhance your automotive audio setup, this amplifier delivers exceptional sound quality and efficiency. With Onsemi's trusted reputation for producing top-notch electronic components, you can trust that you are investing in a product that will exceed your expectations. Upgrade your audio experience today with the NCP2815BFCT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and reduces the risk of damage during handling and installation.

Surface Mount: YES

Surface mount technology allows for a more compact and lightweight design, making the amplifier suitable for space-constrained applications.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and functionality, offering more versatility in audio amplification.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures optimal performance and sound quality for audio applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the amplifier to function reliably even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the amplifier remains operational in a wide range of temperature environments.

Technical Specifications

Audio & Video Amplifiers NCP2815BFCT1G attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B12

No. of Functions:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.2 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

NCP2815BFCT1G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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