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NCP2705FCCT1G

Onsemi

NCP2705FCCT1G by Onsemi

NCP2705FCCT1G by Onsemi is an audio amplifier IC with 20 terminals in a rectangular plastic/epoxy package. It operates b/w -40 to 85 °C, suitable for industrial applications. With power supplies of 1.8/3.3V and 3/5V, it consumes a max current of 3mA, making it ideal for audio and video amplification needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,498 parts In-Stock

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Vyrian

USA . 1,823 parts In-Stock

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1,823

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Problanco Electronics

Mexico . 5,070 parts In-Stock

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5,070

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TANS Electronics

Latvia . 3,498 parts In-Stock

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Kulean Microsystems

USA . 3,069 parts In-Stock

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Corphita

USA . 1,213 parts In-Stock

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SupplyDigital Components

Austria . 967 parts In-Stock

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UHIMA Technologies

Türkiye . 672 parts In-Stock

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Corohmni

South Africa . 64 parts In-Stock

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Overview

Enhance your audio and video experience with the NCP2705FCCT1G from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that guarantee reliability and performance. The NCP2705FCCT1G is perfect for a wide range of applications in audio and video amplification, providing clear sound and crisp visuals. With its advanced features and easy installation, this product offers exceptional value and benefits to customers looking to elevate their entertainment systems. Trust Onsemi for high-quality solutions that enhance your overall experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to damage, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, ideal for space-constrained applications.

General IC Type: AUDIO AMPLIFIER

Specifically designed as an audio amplifier, ensuring high-quality sound reproduction and performance.

Power Supplies (V): 1.8/3.3,3/5

Support for multiple power supply voltages offers flexibility in various operating environments.

No. of Terminals: 20

Sufficient number of terminals allow for easy connectivity and integration with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high-density mounting and precise connections.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in hot environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in cold conditions as well.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh industrial environments.

Terminal Form: BALL

Ball terminal form provides a secure and reliable electrical connection.

Maximum Supply Current: 3 mA

Low maximum supply current consumption helps in saving power and increasing efficiency.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise connections on the PCB.

Technical Specifications

Audio & Video Amplifiers NCP2705FCCT1G attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B20

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8/3.3,3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

NCP2705FCCT1G General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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