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TPA6110A2DGNRG4

Texas Instruments

TPA6110A2DGNRG4 by Texas Instruments

TPA6110A2DGNRG4 by Texas Instruments is a small outline, heat sink audio amplifier with a power supply range of 2.5V to 5.5V and a max output power of 0.15W. It is suitable for industrial applications requiring low harmonic distortion and a wide nominal bandwidth of 0.02 kHz.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 26,200 parts In-Stock

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Vyrian

USA . 8,037 parts In-Stock

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Pegasus Components GmbH

Germany . 7,328 parts In-Stock

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7,328

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Digiode

USA . 4,662 parts In-Stock

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Nova Conductors

Japan . 38 parts In-Stock

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38

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Distributors (Availability)

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Parana Technologies

USA . 2,230 parts In-Stock

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$2.035

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$2.558

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2,230

$2.035

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$2.558

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Corohmni

South Africa . 618 parts In-Stock

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$2.228

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618

$2.228

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DigiPath Technology Company

USA . 975 parts In-Stock

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$2.241

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$2.062

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975

$2.241

$2.062

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ChromeModa Solutions

Germany . 2,610 parts In-Stock

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$2.287

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$1.875

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$2.287

$1.875

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IDEA Electronic Components Group

UK . 253 parts In-Stock

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$2.287

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$2.058

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253

$2.287

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$2.058

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Ampacity Inc.

Singapore . 1,522 parts In-Stock

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$8.800

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$8.800

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AZTECH Wire

Italy . 533 parts In-Stock

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$12.616

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One Stop Electronics

USA . 351 parts In-Stock

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$18.800

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Lixinc

USA . 16,125 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,138 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

Canada . 7,500 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 2,970 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Microchip USA

USA . 2,182 parts In-Stock

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Argo Parts USA

USA . 1,453 parts In-Stock

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Continental Prestige Electronics

USA . 1,364 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the TPA6110A2DGNRG4, an exceptional audio amplifier by Texas Instruments. With its unparalleled quality and precision engineering, Texas Instruments has established itself as a leader in the industry. The TPA6110A2DGNRG4 offers customers unmatched value and benefits. Whether you're looking to enhance your audio experience or amplify sound in your video applications, this product delivers outstanding performance. With its compact design and wide operating range, it's perfect for various projects. Trust Texas Instruments and elevate your audio and video amplification with the TPA6110A2DGNRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a plastic/epoxy body material, which offers durability and lightweight design, making it a good choice for easy installation and transportation.

Surface Mount: YES

With surface mount capabilities, this product can be easily integrated into various electronic devices, providing flexibility and convenience in circuit design and assembly.

No. of Functions: 1

With a single function, this product offers a straightforward solution for audio amplification needs, simplifying the design process and ensuring optimal performance.

Package Shape: SQUARE

The square package shape of this amplifier allows for efficient use of space, making it a suitable choice for compact electronic devices where size is a constraint.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification purposes, this product ensures high-quality sound reproduction, making it a great choice for enhancing audio experiences.

Harmonic Distortion: 0.1%

With low harmonic distortion, this amplifier delivers clear, distortion-free sound, providing an enjoyable audio experience without compromising audio fidelity.

Power Supplies (V): 3.3/5

This product supports a wide range of power supplies, making it compatible with various systems and allowing for versatile usage in different environments.

No. of Terminals: 8

The eight terminals of this amplifier provide multiple connection options, enabling easy integration and configuration in audio and video systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style offers a combination of small size, efficient heat dissipation, slim profile, and reduced pitch, making it an ideal choice for space-constrained applications while ensuring optimal thermal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions and maintain reliable performance, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range in which this amplifier can operate ensures versatility and allows usage in diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel, palladium, gold, and silver terminal finish enhances conductivity and provides excellent corrosion resistance, ensuring long-term reliability and durability of the amplifier.

Terminal Position: DUAL

The dual terminal position enables flexible mounting and connection options, adding convenience and versatility during installation and integration.

Nominal Output Power: 0.15 W

With a nominal output power of 0.15 W, this amplifier delivers sufficient power for audio amplification needs, making it suitable for various applications, including small speakers and headphones.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a compact design, making this amplifier an excellent choice for space-restricted applications where thickness is a concern.

Width: 3 mm

With a slim width of 3 mm, this amplifier can be easily accommodated in narrow electronic systems, providing flexibility in circuit layout and design.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement allows for efficient power utilization and usage with low-power sources, making it energy-efficient and suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

This amplifier can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly and minimizing the risk of thermal damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures compatibility with standard soldering processes, enhancing the reliability and manufacturability of this product.

Length: 3 mm

The compact length of 3 mm contributes to the overall small form factor of this amplifier, allowing for seamless integration in space-limited electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, this amplifier is suitable for use in demanding environments with high temperature fluctuations and ensures reliable performance in such conditions.

No. of Channels: 2

With two channels, this amplifier provides stereo sound output, offering an immersive audio experience for users.

Technology: CMOS

The use of complementary metal-oxide-semiconductor (CMOS) technology ensures low power consumption, reduced noise, and compatibility with various electronic systems, making this amplifier ideal for energy-efficient applications.

Nominal Bandwidth: 0.02 kHz

With a nominal bandwidth of 0.02 kHz, this amplifier offers a wide frequency range for audio signal amplification, allowing for accurate and detailed sound reproduction.

Terminal Form: GULL WING

The gull-wing terminal form facilitates efficient soldering and ensures secure electrical connections, enhancing the overall reliability and lifespan of this amplifier.

Maximum Supply Current: 3 mA

With a low maximum supply current requirement, this amplifier consumes minimal power, making it energy-efficient and suitable for low-power applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables close spacing of terminals, contributing to compact circuit designs and allowing for high-density integration of this amplifier.

Gain: 20 dB

With a gain of 20 dB, this amplifier offers significant signal amplification, resulting in improved audio quality and volume levels for enhanced listening experiences.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level (MSL) rating of 1 indicates that this product has a low moisture absorption rate, ensuring its integrity and reliability under humid conditions.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage capability of 5.5 V allows for compatibility with various power sources, offering flexibility and versatility in different applications.

Technical Specifications

Audio & Video Amplifiers TPA6110A2DGNRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

20 dB

Harmonic Distortion:

.1 %

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.15 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA6110A2DGNRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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