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TPA6211A1DRBRG4

Texas Instruments

TPA6211A1DRBRG4 by Texas Instruments

TPA6211A1DRBRG4 by Texas Instruments is an audio amplifier with 3.1W output power, 10% harmonic distortion, and 105dB noise figure. Ideal for industrial applications requiring a small outline package with a very thin profile and dual terminals for easy installation in tight spaces.

Median Price

$0.880

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,128 parts In-Stock

1+ parts

$0.880

100+ parts

$0.482

1k+ parts

$0.412

10k+ parts

$0.383

4,128

$0.880

$0.482

$0.412

$0.383

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.487

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.487

-

-

-

Digiode

USA . 2,790 parts In-Stock

1+ parts

$0.836

100+ parts

-

1k+ parts

-

10k+ parts

-

2,790

$0.836

-

-

-

Vyrian

USA . 4,721 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,721

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$0.311

100+ parts

$0.296

1k+ parts

$0.296

10k+ parts

-

5,000

$0.311

$0.296

$0.296

-

Continental Prestige Electronics

USA . 6,975 parts In-Stock

1+ parts

$0.487

100+ parts

-

1k+ parts

-

10k+ parts

$0.477

6,975

$0.487

-

-

$0.477

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.487

100+ parts

$0.477

1k+ parts

-

10k+ parts

-

2,000

$0.487

$0.477

-

-

Argo Parts USA

USA . 1,748 parts In-Stock

1+ parts

$0.487

100+ parts

-

1k+ parts

-

10k+ parts

$0.472

1,748

$0.487

-

-

$0.472

Modulus Dynamics

Lithuania . 50 parts In-Stock

1+ parts

$0.541

100+ parts

$0.535

1k+ parts

$0.519

10k+ parts

-

50

$0.541

$0.535

$0.519

-

Ampacity Inc.

Singapore . 4,953 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4,953

$0.750

-

-

-

Corphita

USA . 4,609 parts In-Stock

1+ parts

$0.792

100+ parts

-

1k+ parts

-

10k+ parts

-

4,609

$0.792

-

-

-

Parana Technologies

USA . 1,592 parts In-Stock

1+ parts

$1.277

100+ parts

-

1k+ parts

$2.038

10k+ parts

-

1,592

$1.277

-

$2.038

-

Semicontronic

India . 4,870 parts In-Stock

1+ parts

$1.370

100+ parts

$1.336

1k+ parts

$1.329

10k+ parts

-

4,870

$1.370

$1.336

$1.329

-

DigiPath Technology Company

USA . 2,362 parts In-Stock

1+ parts

$1.406

100+ parts

$1.294

1k+ parts

-

10k+ parts

-

2,362

$1.406

$1.294

-

-

ChromeModa Solutions

Germany . 4,198 parts In-Stock

1+ parts

$1.435

100+ parts

$1.177

1k+ parts

-

10k+ parts

-

4,198

$1.435

$1.177

-

-

IDEA Electronic Components Group

UK . 867 parts In-Stock

1+ parts

$1.435

100+ parts

-

1k+ parts

$1.292

10k+ parts

-

867

$1.435

-

$1.292

-

Corohmni

South Africa . 28 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

-

10k+ parts

-

28

$3.800

-

-

-

Microchip USA

USA . 1,609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,609

-

-

-

-

Overview

Elevate your audio experience with the TPA6211A1DRBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio amplifiers that provide crystal-clear sound and reliable performance. Ideal for a variety of applications in the audio and video realm, this amplifier offers unparalleled value to customers seeking high-quality sound reproduction. Upgrade your audio system today with the TPA6211A1DRBRG4 and immerse yourself in an exceptional listening experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the amplifier easy to handle and resistant to damage.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output.

Nominal Output Power: 3.1 W

Provides sufficient power for amplifying audio signals accurately and efficiently.

Nominal Noise Figure: 105 dB

Ensures a high signal-to-noise ratio, resulting in clear and distortion-free audio output.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient operation, making it ideal for portable and battery-powered devices.

Technical Specifications

Audio & Video Amplifiers TPA6211A1DRBRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

Nominal Noise Figure:

105 dB

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

3.1 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

TPA6211A1DRBRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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