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TDA8541T

NXP Semiconductors

TDA8541T by NXP Semiconductors

NXP Semiconductors' TDA8541T is an audio amplifier IC with 10% harmonic distortion, 1.2W output power, and 20dB gain. It operates in industrial temperature range (-40 to 85°C) and has a small outline package suitable for surface mount applications. Ideal for compact audio systems requiring high-quality sound amplification.

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7

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Digiode

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Anansix

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Vyrian

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Nova Conductors

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Prism Electronics

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LittleDiode

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Aztec Data Supply Inc.

USA . 420 parts In-Stock

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$1.704

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One Stop Electronics

USA . 1,142 parts In-Stock

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Corohmni

South Africa . 195 parts In-Stock

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Ampacity Inc.

Singapore . 1,218 parts In-Stock

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AZTECH Wire

Italy . 368 parts In-Stock

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Lixinc

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UNI Independent Distributors

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Bastille Electronics

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Overview

Experience superior audio quality with the TDA8541T from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch products like this audio amplifier that is perfect for various applications in the audio and video realm. This small outline package offers a nominal output power of 1.2W, ensuring clear and crisp sound for your projects. With a wide temperature range and low harmonic distortion, the TDA8541T provides value, reliability, and performance that customers can trust. Elevate your audio experience with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the product suitable for portable and long-lasting use.

Surface Mount: YES

Being surface mount allows for easy integration into circuit boards, saving space and allowing for efficient design.

Harmonic Distortion: 10%

Low harmonic distortion ensures high-quality audio output without unwanted noise or interference.

Nominal Output Power: 1.2 W

With a nominal output power of 1.2 W, this amplifier can provide enough power for small to medium-sized audio applications.

Nominal Bandwidth: 0.02 kHz

Wide nominal bandwidth of 0.02 kHz allows for clear audio transmission across a range of frequencies.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures the amplifier can withstand harsh environmental conditions.

Technology: BIPOLAR

Bipolar technology offers reliable performance and efficient operation for audio amplification.

Gain: 20 dB

With a gain of 20 dB, this amplifier can boost the input signal to a desired level without distortion.

Technical Specifications

Audio & Video Amplifiers TDA8541T attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

20 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.2 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA8541T General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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